Inventor
HO PAUL
SG14 patents
⚠️ This page may combine multiple inventors who share the name “HO PAUL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHARTERED SEMICONDUCTOR MFG
12 patentsUS6394114B1May 28, 2002
Method for stripping copper in damascene interconnects
CHARTERED SEMICONDUCTOR MFG20 citations92
US6340608B1Jan 22, 2002
Method of fabricating copper metal bumps for flip-chip or chip-on-board IC bonding on terminating copper pads
CHARTERED SEMICONDUCTOR MFG21 citations92
US6350689B1Feb 26, 2002
Method to remove copper contamination by using downstream oxygen and chelating agent plasma
CHARTERED SEMICONDUCTOR MFG15 citations84
US6967162B2Nov 22, 2005
Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding
CHARTERED SEMICONDUCTOR MFG4 citations74
US6365508B1Apr 2, 2002
Process without post-etch cleaning-converting polymer and by-products into an inert layer
CHARTERED SEMICONDUCTOR MFG11 citations74
US6309982B1Oct 30, 2001
Method for minimizing copper diffusion by doping an inorganic dielectric layer with a reducing agent
CHARTERED SEMICONDUCTOR MFG6 citations74
US6255266B1Jul 3, 2001
Alkyldione peroxides as cleaning solutions for wafer fabs
CHARTERED SEMICONDUCTOR MFG9 citations70
US6132521AOct 17, 2000
Cleaning metal surfaces with alkyldione peroxides
CHARTERED SEMICONDUCTOR MFG4 citations63
US6391783B1May 21, 2002
Method to thin down copper barriers in deep submicron geometries by using alkaline earth element, barrier additives, or self assembly technique
CHARTERED SEMICONDUCTOR MFG6 citations60
US7452808B2Nov 18, 2008
Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding
CHARTERED SEMICONDUCTOR MFG0 citations52
US6565664B2May 20, 2003
Method for stripping copper in damascene interconnects
CHARTERED SEMICONDUCTOR MFG1 citations52
US7060613B2Jun 13, 2006
Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding
CHARTERED SEMICONDUCTOR MFG0 citations50