Inventor
GREER STUART E
US14 patents
⚠️ This page may combine multiple inventors who share the name “GREER STUART E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MOTOROLA INC
9 patentsUS6451681B1Sep 17, 2002
Method of forming copper interconnection utilizing aluminum capping film
MOTOROLA INC159 citations98
US6346469B1Feb 12, 2002
Semiconductor device and a process for forming the semiconductor device
MOTOROLA INC212 citations98
US5470787ANov 28, 1995
Semiconductor device solder bump having intrinsic potential for forming an extended eutectic region and method for making and using the same
MOTOROLA INC251 citations98
US5468655ANov 21, 1995
Method for forming a temporary attachment between a semiconductor die and a substrate using a metal paste comprising spherical modules
MOTOROLA INC148 citations98
US6689680B2Feb 10, 2004
Semiconductor device and method of formation
MOTOROLA INC54 citations96
US6713381B2Mar 30, 2004
Method of forming semiconductor device including interconnect barrier layers
MOTOROLA INC135 citations95
US6107180AAug 22, 2000
Method for forming interconnect bumps on a semiconductor die
MOTOROLA INC164 citations95
US5597737AJan 28, 1997
Method for testing and burning-in a semiconductor wafer
MOTOROLA INC55 citations91
US6117759ASep 12, 2000
Method for multiplexed joining of solder bumps to various substrates during assembly of an integrated circuit package
MOTOROLA INC19 citations79
IBM
5 patentsUS5104695AApr 14, 1992
Method and apparatus for vapor deposition of material onto a substrate
IBM54 citations94
US4202007AMay 6, 1980
Multi-layer dielectric planar structure having an internal conductor pattern characterized with opposite terminations disposed at a common edge surface of the layers
IBM86 citations94
US4602271AJul 22, 1986
Personalizable masterslice substrate for semiconductor chips
IBM60 citations92
US4861425AAug 29, 1989
Lift-off process for terminal metals
IBM29 citations89
US4598470AJul 8, 1986
Method for providing improved electrical and mechanical connection between I/O pin and transverse via substrate
IBM16 citations70