Inventor
LE BAO
US13 patents
⚠️ This page may combine multiple inventors who share the name “LE BAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
PACKARD HUGHES INTERCONNECT CO
8 patentsUS5790377AAug 4, 1998
Integral copper column with solder bump flip chip
PACKARD HUGHES INTERCONNECT CO151 citations98
US5855063AJan 5, 1999
Method of making contact pad having metallically anchored elastomeric electrical contacts
PACKARD HUGHES INTERCONNECT CO49 citations95
US5657207AAug 12, 1997
Alignment means for integrated circuit chips
PACKARD HUGHES INTERCONNECT CO55 citations95
US6313402B1Nov 6, 2001
Stress relief bend useful in an integrated circuit redistribution patch
PACKARD HUGHES INTERCONNECT CO34 citations92
US5738530AApr 14, 1998
Contact pad having metallically anchored elastomeric electrical contacts
PACKARD HUGHES INTERCONNECT CO30 citations92
US5708557AJan 13, 1998
Puncture-resistant electrostatic chuck with flat surface and method of making the same
PACKARD HUGHES INTERCONNECT CO23 citations87
US6085414AJul 11, 2000
Method of making a flexible circuit with raised features protruding from two surfaces and products therefrom
PACKARD HUGHES INTERCONNECT CO28 citations84
US5856641AJan 5, 1999
Switch having raised contact features and a deflectable substrate
PACKARD HUGHES INTERCONNECT CO19 citations83