Inventor

SHEN LEWIS

US32 patents

Patents

32 patents

US6372651B1Apr 16, 2002

Method for trimming a photoresist pattern line for memory gate etching

ADVANCED MICRO DEVICES INC220 citations99

US5795829AAug 18, 1998

Method of high density plasma metal etching

ADVANCED MICRO DEVICES INC61 citations96

US5665641ASep 9, 1997

Method to prevent formation of defects during multilayer interconnect processing

ADVANCED MICRO DEVICES INC32 citations93

US6586339B1Jul 1, 2003

Methods for treating a deep-UV resist mask prior to gate formation etch to improve gate profile

ADVANCED MICRO DEVICES INC28 citations92

US6159860ADec 12, 2000

Method for etching layers on a semiconductor wafer in a single etching chamber

ADVANCED MICRO DEVICES INC23 citations92

US5977601ANov 2, 1999

Method for etching memory gate stack using thin resist layer

ADVANCED MICRO DEVICES INC25 citations92

US5973353AOct 26, 1999

Methods and arrangements for forming a tapered floating gate in non-volatile memory semiconductor devices

ADVANCED MICRO DEVICES INC30 citations92

US5948703ASep 7, 1999

Method of soft-landing gate etching to prevent gate oxide damage

ADVANCED MICRO DEVICES INC34 citations92

US6867097B1Mar 15, 2005

Method of making a memory cell with polished insulator layer

ADVANCED MICRO DEVICES INC45 citations91

US5013675AMay 7, 1991

Method of forming and removing polysilicon lightly doped drain spacers

ADVANCED MICRO DEVICES INC32 citations90

US6878622B1Apr 12, 2005

Method for forming SAC using a dielectric as a BARC and FICD enlarger

ADVANCED MICRO DEVICES INC16 citations84

US6365509B1Apr 2, 2002

Semiconductor manufacturing method using a dielectric photomask

ADVANCED MICRO DEVICES INC18 citations84

US6355546B1Mar 12, 2002

Thermally grown protective oxide buffer layer for ARC removal

ADVANCED MICRO DEVICES INC9 citations74

US6218310B1Apr 17, 2001

RTA methods for treating a deep-UV resist mask prior to gate formation etch to improve gate profile

ADVANCED MICRO DEVICES INC7 citations74

US6159794ADec 12, 2000

Methods for removing silicide residue in a semiconductor device

ADVANCED MICRO DEVICES INC12 citations74

US6110779AAug 29, 2000

Method and structure of etching a memory cell polysilicon gate layer using resist mask and etched silicon oxynitride

ADVANCED MICRO DEVICES INC15 citations74

US6074956AJun 13, 2000

Method for preventing silicide residue formation in a semiconductor device

ADVANCED MICRO DEVICES INC14 citations74

US6011289AJan 4, 2000

Metal oxide stack for flash memory application

ADVANCED MICRO DEVICES INC12 citations74

US5770518AJun 23, 1998

Semiconductor device and method of manufacturing without undercutting conductive lines

ADVANCED MICRO DEVICES INC15 citations74

US5702564ADec 30, 1997

Method of etching conductive lines without undercutting

ADVANCED MICRO DEVICES INC14 citations74

US5604381AFeb 18, 1997

Semiconductor device and method of manufacturing without undercutting conductive lines

ADVANCED MICRO DEVICES INC10 citations74

US6232002B1May 15, 2001

Bilayer anti-reflective coating and etch hard mask

ADVANCED MICRO DEVICES INC7 citations73

US6174819B1Jan 16, 2001

Low temperature photoresist removal for rework during metal mask formation

ADVANCED MICRO DEVICES INC7 citations71

US5675186AOct 7, 1997

Construction that prevents the undercut of interconnect lines in plasma metal etch systems

ADVANCED MICRO DEVICES INC13 citations71

US6534411B1Mar 18, 2003

Method of high density plasma metal etching

ADVANCED MICRO DEVICES INC3 citations63

US6452225B1Sep 17, 2002

Method and structure of etching a memory cell polysilicon gate layer using resist mask and etched silicon oxynitride

ADVANCED MICRO DEVICES INC3 citations63

US6291329B1Sep 18, 2001

Protective oxide buffer layer for ARC removal

ADVANCED MICRO DEVICES INC6 citations63

US6352930B1Mar 5, 2002

Bilayer anti-reflective coating and etch hard mask

ADVANCED MICRO DEVICES INC5 citations62

US5688717ANov 18, 1997

Construction that prevents the undercut of interconnect lines in plasma metal etch systems

ADVANCED MICRO DEVICES INC4 citations60

SHEN LEWIS

Patents

Method for trimming a photoresist pattern line for memory gate etching

Method of high density plasma metal etching

Method to prevent formation of defects during multilayer interconnect processing

Silicon barrier layer to prevent resist poisoning

Semiconductor devices with reduced control gate dimensions

Method for etching memory gate stack using thin resist layer

Methods for treating a deep-UV resist mask prior to gate formation etch to improve gate profile

Method for etching layers on a semiconductor wafer in a single etching chamber

Method for etching memory gate stack using thin resist layer

Methods and arrangements for forming a tapered floating gate in non-volatile memory semiconductor devices

Method of soft-landing gate etching to prevent gate oxide damage

Method of making a memory cell with polished insulator layer

Method of forming and removing polysilicon lightly doped drain spacers

Method for forming SAC using a dielectric as a BARC and FICD enlarger

Semiconductor manufacturing method using a dielectric photomask

Thermally grown protective oxide buffer layer for ARC removal

RTA methods for treating a deep-UV resist mask prior to gate formation etch to improve gate profile

Methods for removing silicide residue in a semiconductor device

Method and structure of etching a memory cell polysilicon gate layer using resist mask and etched silicon oxynitride

Method for preventing silicide residue formation in a semiconductor device

Metal oxide stack for flash memory application

Semiconductor device and method of manufacturing without undercutting conductive lines

Method of etching conductive lines without undercutting

Semiconductor device and method of manufacturing without undercutting conductive lines

Bilayer anti-reflective coating and etch hard mask

Low temperature photoresist removal for rework during metal mask formation

Construction that prevents the undercut of interconnect lines in plasma metal etch systems

Method of high density plasma metal etching

Method and structure of etching a memory cell polysilicon gate layer using resist mask and etched silicon oxynitride

Protective oxide buffer layer for ARC removal

Bilayer anti-reflective coating and etch hard mask

Construction that prevents the undercut of interconnect lines in plasma metal etch systems