Inventor

LEE KUN-TACK

KR57 patents

⚠️ This page may combine multiple inventors who share the name “LEE KUN-TACK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE KUN-TACK

SAMSUNG ELECTRONICS CO LTD

Method of removing oxide layer and semiconductor manufacturing apparatus for removing oxide layer

Vertical-type semiconductor device

Method of forming metal interconnection using plating and semiconductor device manufactured by the method

Single type of semiconductor wafer cleaning device

Wet process for semiconductor device fabrication using anode water containing oxidative substances and cathode water containing reductive substances, and anode water and cathode water used in the wet process

Aqueous cleaning solution for removing contaminants surface of circuit substrate cleaning method using the same

Method of treating substrates using supercritical fluids

Methods of manufacturing semiconductor memory devices with unit cells having charge trapping layers

Method of and apparatus for removing contaminants from surface of a substrate

Spot heater and device for cleaning wafer using the same

Apparatus for treating substrates using supercritical fluids, substrate treatment system including the same and method of treating substrates using the same

Apparatus for cleaning semiconductor wafer including heating using a light source and method for cleaning wafer using the same

Method of cleaning semiconductor wafer

Method of and apparatus for removing contaminants from surface of a substrate

Substrate processing apparatus and apparatus for manufacturing integrated circuit device

Spot heater and device for cleaning wafer using the same

Method of forming fine pitch hardmask patterns and method of forming fine patterns of semiconductor device using the same

Apparatus for treating wafers using supercritical fluid

Cleaning solution and method for selectively removing layer in a silicidation process

Wafer cleaning apparatus and wafer cleaning method using the same

Substrate processing apparatus and apparatus for manufacturing integrated circuit device

Wafer cleaning apparatus and wafer cleaning method using the same

Wafer cleaning equipment

Method of removing chemicals from a substrate

Apparatus for cleaning semiconductor wafer and method for cleaning wafer using the same

Wafer cleaning apparatus and wafer cleaning method using the same

Chemical mechanical polishing apparatus, chemical mechanical polishing method and method for fabricating semiconductor device

Wafer cleaning apparatus, method for cleaning wafer and method for fabricating semiconductor device

Wafer cleaning apparatus, method for cleaning wafer and method for fabricating semiconductor device

Semiconductor memory device and method for manufacturing the same

Substrate drying apparatus and semiconductor device manufacturing method using same

Apparatus for treating wafers using supercritical fluid

Cleaning solution composition and method of cleaning semiconductor device using the same

Method of fabricating a semiconductor device

Cleaning solution for removing damaged portion of ferroelectric layer and cleaning method using the same

Multi-chamber apparatus

Method of removing photoresist and method of manufacturing a semiconductor device

Method of forming a spacer

Storage nodes of a semiconductor memory

LEE HYO-SAN

Etching, cleaning and drying methods using supercritical fluid and chamber systems using these methods

Etching, cleaning and drying methods using supercritical fluid and chamber systems using these methods

Etching, cleaning and drying methods using supercritical fluid and chamber systems using these methods

Apparatus for treating wafers using supercritical fluid

Method of manufacturing a semiconductor device using an etchant

Methods of forming a hole having a vertical profile and semiconductor devices having a vertical hole

KANG DAE-HYUK

Integrated circuit capacitors having sidewall supports

Methods of forming integrated circuit capacitors having sidewall supports and capacitors formed thereby

Method of forming a contact structure

CHO YONG-JHIN

Substrate processing method and substrate processing system for performing the same

CHOI JAE-KWANG

Chemical mechanical polishing apparatus having pad conditioning disk and pre-conditioner unit