Inventor

ASPAR BERNARD

FR75 patents

⚠️ This page may combine multiple inventors who share the name “ASPAR BERNARD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ASPAR BERNARD

COMMISSARIAT ENERGIE ATOMIQUE

Method of producing a thin layer of semiconductor material

Method for producing a thin film comprising introduction of gaseous species

Method of producing a thin layer of semiconductor material

Method for making a thin film using pressurization

Method for transferring a thin film comprising a step of generating inclusions

Method for making a thin film on a support and resulting structure including an additional thinning stage before heat treatment causes micro-cavities to separate substrate element

Method for making a thin film of solid material

Method of producing a thin layer of semiconductor material

Method for achieving a thin film of solid material and applications of this method

Method of producing a thin layer of semiconductor material

Selective transfer of elements from one support to another support

Method of obtaining a thin film of semiconductor material

Heat treatment method for semiconductor substrates

Method of producing a thin layer of semiconductor material

Method for making a stacked comprising a thin film adhering to a target substrate

Method for obtaining a thin film in particular semiconductor, comprising a protected ion zone and involving an ion implantation

Multilayer structure with controlled internal stresses and making same

Method for producing a thin membrane and resulting structure with membrane

Detachable substrate with controlled mechanical strength and method of producing same

Detachable substrate or detachable structure and method for the production thereof

Process for the transfer of a thin film

Process for the transfer of a thin film

Method for producing a buried layer of material in another material

Treatment process for molecular bonding and unbonding of two structures

Embrittled substrate and method for making same

Method of producing mixed substrates and structure thus obtained

Process for the manufacture of passive and active components on the same insulating substrate

Method for separating two elements and a device therefor

Method for cutting a block of material and forming a thin film

Method for selectively transferring at least an element from an initial support onto a final support

Manufacturing process for a stacked structure comprising a thin layer bonding to a target substrate

Process for the transfer of a thin film comprising an inclusion creation step

Method for making thin layers containing microcomponents

Layer transfer method

Formation of a semiconductor substrate that may be dismantled and obtaining a semiconductor element

Method for separating wafers bonded together to form a stacked structure

Composite structure with a uniform crystal orientation and the method of controlling the crystal orientation of one such structure

Method for producing thin layers on a specific support and an application thereof

SOITEC SILICON ON INSULATOR

Method for trimming a structure obtained by the assembly of two plates

Method for transferring wafers

Heterostructure and method of fabrication

Structure for radio frequency applications

Heterostructure and method of fabrication

COMMISSARIAT A L ATOMIQUE

Structure comprising a thin layer of material made up of conductive zones and insulating zones and a method of manufacturing such a structure

COMMISARIAT L EN ATOMIQUE

Method for handling semiconductor layers in such a way as to thin same

MORICEAU HUBERT

Manufacturing process for a stacked structure comprising a thin layer bonding to a target substrate

ASPAR BERNARD

Method of producing a thin layer of semiconductor material

E2V SEMICONDUCTORS

Process for the collective fabrication of microstructures consisting of superposed elements

ZUSSY MARC

Method for trimming a structure obtained by the assembly of two plates

LAGAHE CHRYSTELLE

Process of treating defects during the bonding of wafers