Inventor

SENG ERIC TAN SWEE

SG18 patents

⚠️ This page may combine multiple inventors who share the name “SENG ERIC TAN SWEE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SENG ERIC TAN SWEE

MICRON TECHNOLOGY INC

Packaged microelectronic component assemblies

Packaged microelectronic devices and methods of forming same

Packaged microelectronic devices and methods of forming same

Ball grid array interposer, packages and methods

Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components

Assemblies and multi-chip modules including stacked semiconductor dice having centrally located, wire bonded bond pads

Methods of forming a multi-chip module having discrete spacers

Invertible microfeature device packages

Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components

Semiconductor device assemblies including face-to-face semiconductor dice and systems including such assemblies

Invertible microfeature device packages

Interposers with receptacles for receiving semiconductor devices and assemblies and packages including such interposers

Methods for assembling semiconductor devices and interposers

Multi-chip modules including stacked semiconductor dice

Semiconductor device assemblies including face-to-face semiconductor dice and related methods

Microelectronic component assemblies with recessed wire bonds and methods of making same

SENG ERIC TAN SWEE

Methods for forming assemblies and multi-chip modules including stacked semiconductor dice

Assemblies and multi-chip modules including stacked semiconductor dice having centrally located, wire bonded bond pads