Inventor
AHN SANG-HO
KR17 patents
⚠️ This page may combine multiple inventors who share the name “AHN SANG-HO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
6 patentsUS6977439B2Dec 20, 2005
Semiconductor chip stack structure
SAMSUNG ELECTRONICS CO LTD55 citations95
US7213329B2May 8, 2007
Method of forming a solder ball on a board and the board
SAMSUNG ELECTRONICS CO LTD32 citations86
US7012325B2Mar 14, 2006
Ultra-thin semiconductor package device and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD15 citations83
US7253026B2Aug 7, 2007
Ultra-thin semiconductor package device and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD5 citations73
US6818976B2Nov 16, 2004
Bumped chip carrier package using lead frame
SAMSUNG ELECTRONICS CO LTD12 citations73
US7109065B2Sep 19, 2006
Bumped chip carrier package using lead frame and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD3 citations62
UNIV AJOU IND ACADEMIC COOP FOUND
2 patentsUS11519853B2Dec 6, 2022
Method for evaluating the suitability for power generation using biogas, server and system using the same
UNIV AJOU IND ACADEMIC COOP FOUND0 citations46
US11195014B1Dec 7, 2021
Method and apparatus for estimating state of waterproof paint of buildings using satellite imagery
UNIV AJOU IND ACADEMIC COOP FOUND0 citations46