Inventor
YANG SUN-MO
KR13 patents
⚠️ This page may combine multiple inventors who share the name “YANG SUN-MO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG MEDISON CO LTD
9 patentsUS10387713B2Aug 20, 2019
Apparatus and method of processing medical image
SAMSUNG MEDISON CO LTD2 citations72
US9818019B2Nov 14, 2017
Apparatus and method of processing medical image
SAMSUNG MEDISON CO LTD3 citations72
US11234672B2Feb 1, 2022
Ultrasonic imaging apparatus and method for controlling the same
SAMSUNG MEDISON CO LTD2 citations71
US10517573B2Dec 31, 2019
Method, apparatus, and system for adjusting brightness of ultrasound image by using prestored gradation data and images
SAMSUNG MEDISON CO LTD2 citations71
US10874378B2Dec 29, 2020
Wireless probe, ultrasound diagnostic apparatus, and method of controlling wireless probe and ultrasound diagnostic apparatus
SAMSUNG MEDISON CO LTD1 citations62
US11672513B2Jun 13, 2023
Method, apparatus, and system for adjusting brightness of ultrasound image by using prestored gradation data and images
SAMSUNG MEDISON CO LTD0 citations61
US11607191B2Mar 21, 2023
Ultrasound diagnosis apparatus and method of acquiring shear wave elasticity data with respect to object cross-section in 3D
SAMSUNG MEDISON CO LTD1 citations61
US10702243B2Jul 7, 2020
Ultrasound diagnosis apparatus, wearable device, method of controlling ultrasound diagnosis apparatus, method of controlling wearable device, and recording medium having methods recorded thereon
SAMSUNG MEDISON CO LTD1 citations61
US10772601B2Sep 15, 2020
Ultrasonic imaging apparatus and method for controlling the same
SAMSUNG MEDISON CO LTD0 citations39
SAMSUNG ELECTRONICS CO LTD
4 patentsUS6977439B2Dec 20, 2005
Semiconductor chip stack structure
SAMSUNG ELECTRONICS CO LTD55 citations95
US6620028B2Sep 16, 2003
Apparatus for cutting a wafer
SAMSUNG ELECTRONICS CO LTD2 citations62
US7371675B2May 13, 2008
Method and apparatus for bonding a wire
SAMSUNG ELECTRONICS CO LTD3 citations61
US7605478B2Oct 20, 2009
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations51