Inventor
HUSSEIN MAKAREM
US4 patents
Patents
4 patentsUS6958547B2Oct 25, 2005
Interconnect structures containing conductive electrolessly deposited etch stop layers, liner layers, and via plugs
INTEL CORP71 citations97
US7008872B2Mar 7, 2006
Use of conductive electrolessly deposited etch stop layers, liner layers and via plugs in interconnect structures
INTEL CORP59 citations95
US6384481B1May 7, 2002
Single step electroplating process for interconnect via fill and metal line patterning
INTEL CORP33 citations91
US6020266AFeb 1, 2000
Single step electroplating process for interconnect via fill and metal line patterning
INTEL CORP33 citations91