Inventor

BRAIN RUTH A

US27 patents

⚠️ This page may combine multiple inventors who share the name “BRAIN RUTH A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BRAIN RUTH A

INTEL CORP

Interconnect structures containing conductive electrolessly deposited etch stop layers, liner layers, and via plugs

Use of conductive electrolessly deposited etch stop layers, liner layers and via plugs in interconnect structures

Method of forming a metal line utilizing electroplating

Method and structure to contact tight pitch conductive layers with guided vias using alternating hardmasks and encapsulating etchstop liner scheme

Via blocking layer

Decoupled via fill

Techniques for forming logic including integrated spin-transfer torque magnetoresistive random-access memory

Etchstop layers and capacitors

Conductive via and metal line end fabrication and structures resulting therefrom

Decoupled via fill

Power shared cell architecture

Decoupled via fill

Plug and trench architectures for integrated circuits and methods of manufacture

Plug and trench architectures for integrated circuits and methods of manufacture

Conductive cap-based approaches for conductive via fabrication and structures resulting therefrom

Via blocking layer

Via blocking layer

Etchstop layers and capacitors

Etchstop layers and capacitors

AVD hardmask for damascene patterning

AVD hardmask for damascene patterning

Decoupled via fill

CALIFORNIA INST OF TECHN

Method and apparatus for selectively annealing heterostructures using microwaves

Method and apparatus for selectively annealing heterostructures using microwave

BRAIN RUTH A

Etchstop layers and capacitors

AVD hardmask for damascene patterning

PELTO CHRISTOPHER M

Landing structure for through-silicon via