Inventor
WU CHIH-NING
TW22 patents
⚠️ This page may combine multiple inventors who share the name “WU CHIH-NING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
20 patentsUS7491615B2Feb 17, 2009
Method of fabricating strained-silicon transistors and strained-silicon CMOS transistors
UNITED MICROELECTRONICS CORP54 citations96
US6767825B1Jul 27, 2004
Etching process for forming damascene structure of the semiconductor
UNITED MICROELECTRONICS CORP26 citations92
US6635565B2Oct 21, 2003
Method of cleaning a dual damascene structure
UNITED MICROELECTRONICS CORP32 citations92
US6303482B1Oct 16, 2001
Method for cleaning the surface of a semiconductor wafer
UNITED MICROELECTRONICS CORP34 citations92
US6780761B1Aug 24, 2004
Via-first dual damascene process
UNITED MICROELECTRONICS CORP20 citations90
US6733597B2May 11, 2004
Method of cleaning a dual damascene structure
UNITED MICROELECTRONICS CORP11 citations74
US6554002B2Apr 29, 2003
Method for removing etching residues
UNITED MICROELECTRONICS CORP9 citations74
US7214988B2May 8, 2007
Metal oxide semiconductor transistor
UNITED MICROELECTRONICS CORP8 citations73
US7172976B2Feb 6, 2007
Extrusion-free wet cleaning process for copper-dual damascene structures
UNITED MICROELECTRONICS CORP5 citations73
US6794292B2Sep 21, 2004
Extrusion-free wet cleaning process for copper-dual damascene structures
UNITED MICROELECTRONICS CORP8 citations73
US6511916B1Jan 28, 2003
Method for removing the photoresist layer in the damascene process
UNITED MICROELECTRONICS CORP7 citations73
US7338910B2Mar 4, 2008
Method of fabricating semiconductor devices and method of removing a spacer
UNITED MICROELECTRONICS CORP6 citations63
US6692580B2Feb 17, 2004
Method of cleaning a dual damascene structure
UNITED MICROELECTRONICS CORP4 citations63
US6453915B1Sep 24, 2002
Post polycide gate etching cleaning method
UNITED MICROELECTRONICS CORP5 citations63
US7196019B2Mar 27, 2007
Method of removing spacers and fabricating MOS transistor
UNITED MICROELECTRONICS CORP2 citations59
US7544621B2Jun 9, 2009
Method of removing a metal silicide layer on a gate electrode in a semiconductor manufacturing process and etching method
UNITED MICROELECTRONICS CORP5 citations58
US6440873B1Aug 27, 2002
Post metal etch cleaning method
UNITED MICROELECTRONICS CORP1 citations52
US7595234B2Sep 29, 2009
Fabricating method for a metal oxide semiconductor transistor
UNITED MICROELECTRONICS CORP0 citations51
US7220647B2May 22, 2007
Method of cleaning wafer and method of manufacturing gate structure
UNITED MICROELECTRONICS CORP0 citations48
US7135400B2Nov 14, 2006
Damascene process capable of avoiding via resist poisoning
UNITED MICROELECTRONICS CORP0 citations35