Inventor
GONG DEMEI
CH4 patents
⚠️ This page may combine multiple inventors who share the name “GONG DEMEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SUN MING
3 patentsUS8159828B2Apr 17, 2012
Low profile flip chip power module and method of making
SUN MING15 citations81
US7202113B2Apr 10, 2007
Wafer level bumpless method of making a flip chip mounted semiconductor device package
SUN MING4 citations60
US7466014B2Dec 16, 2008
Flip chip mounted semiconductor device package having a dimpled leadframe
SUN MING0 citations49