Inventor

LEE MICHAEL G

US70 patents

⚠️ This page may combine multiple inventors who share the name “LEE MICHAEL G”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE MICHAEL G

FUJITSU LTD

Through hole interconnect substrate fabrication process

Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making

Method for joining conductive structures and an electrical conductive article

Three-dimensional opto-electronic modules with electrical and optical interconnections and methods for making

Opto-electronic substrates with electrical and optical interconnections and methods for making

Reduced stress and zero stress interposers for integrated-circuit chips, multichip substrates, and the like

Systems based on opto-electronic substrates with electrical and optical interconnections and methods for making

Reduced cross-talk noise high density signal interposer with power and ground wrap

Controlled impedence interposer substrate

Fabrication procedure for a stable post

Method and system for joining and an ultra-high density interconnect

Methods of planarizing structures on wafers and substrates by polishing

Controlled impedance interposer substrate and method of making

High density signal interposer with power and ground wrap

Sputtered and anodized capacitors capable of withstanding exposure to high temperatures

Multichip module substrate

Method for fabricating thin-film interconnector

Conductive interconnect structures and methods for forming conductive interconnect structures

Methods of etching through wafers and substrates with a composite etch stop layer

Optical apparatuses providing optical interconnections among a plurality of electronic components

Method of fabricating a substrate with a via connection

Power conducting substrates with high-yield integrated substrate capacitor

Method for electroplating vias or through holes in substrates having conductors on both sides

Methods of planarizing structures on wafers and substrates by polishing

Process for fabricating a substrate with thin film capacitor

Interconnect assembly and Z-connection method for fine pitch substrates

Stencil and method for depositing solder

Method and system for providing an aligned semiconductor assembly

Opto-electronic processors with reconfigurable chip-to-chip optical interconnections

Compact optical devices and methods for making the same

Method and system for controlling chip inclination during flip-chip mounting

Optical interconnect apparatuses and electro-optic modulators for processing systems

Multilayer interconnection and method

Method of paste printing using stencil and masking layer

Thin film capacitor

Apparatuses and methods for integrating opto-electric components into the optical pathways of routing substrates with precision optical coupling and compact electrical interconnection

Thin film electro-optical deflector device and a method of fabrication of such a device

Apparatus for uniform chemical mechanical polishing by intermittent lifting and reversible rotation

Controlled retention of slurry in chemical mechanical polishing

Wet chemical processing techniques for plating high aspect ratio features

NORTEL NETWORKS LTD

Method and apparatus for securely transmitting encrypted data through a firewall and for monitoring user traffic

Call features for automatic call distribution system

Network communication authentication

SPACELABS INC

Recorder for a medical monitor

Medical monitor

Medical monitor

CAFFE ACORTO INC

Automated milk inclusive coffee apparatus

Beverage valve venturi apparatus

LUMEX

Exercise treadmill with variable response to foot impact induced speed variation

LEE MICHAEL G

Method and system for providing a reliable semiconductor assembly