Inventor
TSENG CHUAN-CHI
TW3 patents
Patents
3 patentsUS10605540B2Mar 31, 2020
Vapor chamber that utilizes a capillary structure and bumps to form a liquid-vapor channel
TAI SOL ELECTRONICS CO LTD3 citations67
USD909979SFeb 9, 2021
Vapor chamber
TAI SOL ELECTRONICS CO LTD2 citations64
US10240873B2Mar 26, 2019
Joint assembly of vapor chambers
TAI SOL ELECTRONICS CO LTD0 citations35