Inventor
TZENG CHIH-MING
TW9 patents
⚠️ This page may combine multiple inventors who share the name “TZENG CHIH-MING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IND TECH RES INST
5 patentsUS7294920B2Nov 13, 2007
Wafer-leveled chip packaging structure and method thereof
IND TECH RES INST92 citations98
US7528009B2May 5, 2009
Wafer-leveled chip packaging structure and method thereof
IND TECH RES INST20 citations92
US10672677B2Jun 2, 2020
Semiconductor package structure
IND TECH RES INST2 citations70
US10288696B2May 14, 2019
Intelligent diagnosis system for power module and method thereof
IND TECH RES INST1 citations61
US12334854B2Jun 17, 2025
Power integrated module and motor control system
IND TECH RES INST0 citations50