Inventor
KITAHARA NOBUYASU
JP13 patents
⚠️ This page may combine multiple inventors who share the name “KITAHARA NOBUYASU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DISCO CORP
11 patentsUS7179723B2Feb 20, 2007
Wafer processing method
DISCO CORP138 citations97
US7915140B2Mar 29, 2011
Fabrication method for device having die attach film on the back side thereof
DISCO CORP22 citations91
US7696014B2Apr 13, 2010
Method for breaking adhesive film mounted on back of wafer
DISCO CORP12 citations83
US7446022B2Nov 4, 2008
Wafer laser processing method
DISCO CORP15 citations83
US9700961B2Jul 11, 2017
Ablation method for die attach film
DISCO CORP3 citations71
US7396780B2Jul 8, 2008
Method for laser processing of wafer
DISCO CORP4 citations59
US11133186B2Sep 28, 2021
Processing method of workpiece
DISCO CORP0 citations50
US11892282B2Feb 6, 2024
Protective film thickness measuring method
DISCO CORP0 citations49
US9054179B2Jun 9, 2015
Wafer processing method
DISCO CORP1 citations49
US10201936B2Feb 12, 2019
Jig and processing method using jig
DISCO CORP0 citations40
US7799700B2Sep 21, 2010
Method for applying resin film to face of semiconductor wafer
DISCO CORP0 citations39