P

Inventor

FURIHATA HIDEMICHI

JP16 patents

Patents

16 patents
US7425474B2Sep 16, 2008

Method of manufacturing thin film transistor, method of manufacturing electro-optical device thin film transistor, and electro-optical device

SEIKO EPSON CORP14 citations84
US7361594B2Apr 22, 2008

Method of manufacturing a thin film transistor, thin film transistor, thin film transistor circuit, electronic device, and electronic apparatus

SEIKO EPSON CORP12 citations84
US7305761B2Dec 11, 2007

Method for manufacturing wiring substrate

SEIKO EPSON CORP8 citations73
US7404885B2Jul 29, 2008

Plating method and electronic device

SEIKO EPSON CORP4 citations62
US6515953B1Feb 4, 2003

Processing method of a master disc for optical discs and processing method of grooves

SEIKO EPSON CORP4 citations62
US11133454B2Sep 28, 2021

Piezoelectric element, liquid discharge head, and printer

SEIKO EPSON CORP0 citations57
US9254657B1Feb 9, 2016

Flow path component, liquid discharge head, and liquid discharge apparatus

SEIKO EPSON CORP2 citations57
US11312137B2Apr 26, 2022

Piezoelectric element, liquid discharge head, and printer

SEIKO EPSON CORP0 citations53
US7521361B2Apr 21, 2009

Method for manufacturing wiring substrate

SEIKO EPSON CORP1 citations52
US7597813B2Oct 6, 2009

Element substrate and method of manufacturing the same

SEIKO EPSON CORP0 citations51
US10700258B2Jun 30, 2020

Piezoelectric element, manufacturing method thereof, and liquid ejection head

SEIKO EPSON CORP0 citations50
US8636343B2Jan 28, 2014

Liquid ejecting head, liquid ejecting apparatus, and piezoelectric element

SEIKO EPSON CORP0 citations50
US7488678B2Feb 10, 2009

Method of manufacturing interconnect substrate

SEIKO EPSON CORP0 citations50
US8012449B2Sep 6, 2011

Method of manufacturing complex metal oxide powder and amorphous complex metal oxide

SEIKO EPSON CORP0 citations41
US7966720B2Jun 28, 2011

Method of manufacturing an element substrate

SEIKO EPSON CORP0 citations40
US7604835B2Oct 20, 2009

Method for manufacturing wiring substrate and method for manufacturing electronic device

SEIKO EPSON CORP0 citations35