Inventor
TSUKAGOSHI ISAO
JP21 patents
⚠️ This page may combine multiple inventors who share the name “TSUKAGOSHI ISAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI CHEMICAL CO LTD
19 patentsUS6042894AMar 28, 2000
Anisotropically electroconductive resin film
HITACHI CHEMICAL CO LTD110 citations98
US5120665AJun 9, 1992
Method of using an anisotropically electroconductive adhesive having pressure-deformable electroconductive particles to electrically connect circuits
HITACHI CHEMICAL CO LTD180 citations98
US5001542AMar 19, 1991
Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips
HITACHI CHEMICAL CO LTD200 citations98
US5843251ADec 1, 1998
Process for connecting circuits and adhesive film used therefor
HITACHI CHEMICAL CO LTD106 citations97
US6113728ASep 5, 2000
Process for connecting circuits and adhesive film used therefor
HITACHI CHEMICAL CO LTD82 citations96
US6034331AMar 7, 2000
Connection sheet and electrode connection structure for electrically interconnecting electrodes facing each other, and method using the connection sheet
HITACHI CHEMICAL CO LTD60 citations95
US5804882ASep 8, 1998
Semiconductor device having a semiconductor chip electrically connected to a wiring substrate
HITACHI CHEMICAL CO LTD142 citations95
US4740657AApr 26, 1988
Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained
HITACHI CHEMICAL CO LTD211 citations95
US4731282AMar 15, 1988
Anisotropic-electroconductive adhesive film
HITACHI CHEMICAL CO LTD111 citations93
US7258918B2Aug 21, 2007
Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure
HITACHI CHEMICAL CO LTD13 citations92
US6841022B2Jan 11, 2005
Adhesive-coated electronic parts on a connection sheet
HITACHI CHEMICAL CO LTD32 citations92
US6338195B1Jan 15, 2002
Connection sheet and electrode connection structure for electrically interconnecting electrodes facing each other, and method using the connection sheet
HITACHI CHEMICAL CO LTD37 citations92
US6158115ADec 12, 2000
Method of mounting a plurality of electronic parts on a circuit board
HITACHI CHEMICAL CO LTD17 citations92
US6479757B1Nov 12, 2002
Method of mounting a plurality of electronic parts on a circuit board
HITACHI CHEMICAL CO LTD13 citations73
US10186627B2Jan 22, 2019
Conductor connection member, connection structure, and solar cell module
HITACHI CHEMICAL CO LTD1 citations62
US7771559B2Aug 10, 2010
Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure
HITACHI CHEMICAL CO LTD2 citations62
US9660131B2May 23, 2017
Method for connecting conductor, member for connecting conductor, connecting structure and solar cell module
HITACHI CHEMICAL CO LTD1 citations52
US6818086B2Nov 16, 2004
Method for repairing circuit connection part, and structure and method for connecting circuit terminal of circuit repaired by the method
HITACHI CHEMICAL CO LTD0 citations52
US7528488B2May 5, 2009
Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure
HITACHI CHEMICAL CO LTD0 citations51