Inventor

YUSA MASAMI

JP35 patents

⚠️ This page may combine multiple inventors who share the name “YUSA MASAMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YUSA MASAMI

HITACHI CHEMICAL CO LTD

Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device

Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure

Adhesive for circuit connection, circuit connection method using the same, and circuit connection structure

Wiring-connecting material and wiring-connected board production process using the same

Wiring-connecting material and process for producing circuit board with the same

Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package

Electrically conductive bonding films

Electrically conductive bonding films

Alignment film for liquid crystal, liquid crystal-sandwiched panel, liquid crystal display module and material for liquid crystal alignment film

Epoxy resin composition for a copper-clad laminate

Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device

Alkenyl-fluorine-containing aromatic polyamide

Fluorine-containing polyimides and precursors thereof

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof

Chip supporting substrate for semiconductor package, semiconductor device, and method for manufacturing them

Processes for preparation of polyimide-isoindroquinazolinedione and precursor thereof

Adhesive for circuit connection, circuit connection method using the same, and circuit connected structure

Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof

Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device

Resin composition, adhesives prepared therewith for bonding circuit members, and circuit boards

Semiconductor device and process for fabrication thereof

Fluorine-containing polyimides and precursors thereof

Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure

Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device

KATOGI SHIGEKI

Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device

Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device

Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device

Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device

HITACHI COMPANY LTD

Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package

MASUKO TAKASHI

Film-like adhesive, adhesive sheet, and semiconductor device using same