Inventor

MIYADERA YASUO

JP40 patents

⚠️ This page may combine multiple inventors who share the name “MIYADERA YASUO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MIYADERA YASUO

HITACHI CHEMICAL CO LTD

Liquid-crystal alignment film

Environment purifying material

Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device

Amino-protected dopa derivative and production thereof

Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure

Electrically conductive bonding films

Electrically conductive bonding films

Alignment film for liquid crystal, liquid crystal-sandwiched panel, liquid crystal display module and material for liquid crystal alignment film

Epoxy resin composition for a copper-clad laminate

Polyamino-bis-imide resin

Laminates comprising prepregs metal clad

Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of polyimides

Continuous production of copper-clad laminate

Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device

Alkenyl-fluorine-containing aromatic polyamide

Polyimides and thermosetting resin compositions containing the same

Method for surface treatment of polyimide resin molded articles

Fluorine-containing polyimides and precursors thereof

Method of preparing polyamide acid for processing of semiconductors

Method of preparing polyamide acid for processing of semiconductors

Method of preparing polyamide acid type intermediates for processing of semiconductors

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof

Processes for preparation of polyimide-isoindroquinazolinedione and precursor thereof

Polyamino-bis-maleimide prepolymer, method for manufacture thereof, and method for manufacture of laminate using said prepolymer

Polyamino-bis-maleimide prepolymer, method for manufacture thereof, and method for manufacture of laminate using said prepolymer

Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimides

Process for producing a polyimide solution

Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof

Fluorine-containing polyimides and precursors thereof

Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure

HITACHI LTD

Composite fibrous product

Method of making a semiconductor device

Epoxy resin composition having excellent latent hardening characteristics

Heat curable resin composition