Inventor
KWON YONG CHAI
KR17 patents
⚠️ This page may combine multiple inventors who share the name “KWON YONG CHAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
16 patentsUS7915710B2Mar 29, 2011
Method of fabricating a semiconductor device, and semiconductor device with a conductive member extending through a substrate and connected to a metal pattern bonded to the substrate
SAMSUNG ELECTRONICS CO LTD45 citations98
US7777323B2Aug 17, 2010
Semiconductor structure and method for forming the same
SAMSUNG ELECTRONICS CO LTD19 citations92
US7262475B2Aug 28, 2007
Image sensor device and method of manufacturing same
SAMSUNG ELECTRONICS CO LTD30 citations91
US7459774B2Dec 2, 2008
Stacked chip package using photosensitive polymer and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD23 citations89
US7939947B2May 10, 2011
Semiconductor package structure
SAMSUNG ELECTRONICS CO LTD10 citations84
US7884875B2Feb 8, 2011
Camera module having lower connection portions defining a chip region and engaging upper connection portions of a lens structure and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD13 citations84
US7777345B2Aug 17, 2010
Semiconductor device having through electrode and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD12 citations84
US7732328B2Jun 8, 2010
Method of fabricating semiconductor package structure
SAMSUNG ELECTRONICS CO LTD13 citations84
US7602047B2Oct 13, 2009
Semiconductor device having through vias
SAMSUNG ELECTRONICS CO LTD13 citations84
US7588964B2Sep 15, 2009
Methods of stacking semiconductor devices and methods of fabricating semiconductor device packages using the same
SAMSUNG ELECTRONICS CO LTD18 citations84
US7825468B2Nov 2, 2010
Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packages
SAMSUNG ELECTRONICS CO LTD6 citations74
US7521657B2Apr 21, 2009
Assembly having wafer with image sensor chips, a photo-sensitive adhesive pattern and plate thereof and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations62
US7534656B2May 19, 2009
Image sensor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations61
US7371614B2May 13, 2008
Image sensor device and methods thereof
SAMSUNG ELECTRONICS CO LTD2 citations59
US8367472B2Feb 5, 2013
Method of fabricating a 3-D device
SAMSUNG ELECTRONICS CO LTD1 citations52
US8053807B2Nov 8, 2011
Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packages
SAMSUNG ELECTRONICS CO LTD1 citations52