P

Inventor

KWON YONG CHAI

KR17 patents
⚠️ This page may combine multiple inventors who share the name “KWON YONG CHAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

16 patents
US7915710B2Mar 29, 2011

Method of fabricating a semiconductor device, and semiconductor device with a conductive member extending through a substrate and connected to a metal pattern bonded to the substrate

SAMSUNG ELECTRONICS CO LTD45 citations98
US7777323B2Aug 17, 2010

Semiconductor structure and method for forming the same

SAMSUNG ELECTRONICS CO LTD19 citations92
US7262475B2Aug 28, 2007

Image sensor device and method of manufacturing same

SAMSUNG ELECTRONICS CO LTD30 citations91
US7459774B2Dec 2, 2008

Stacked chip package using photosensitive polymer and manufacturing method thereof

SAMSUNG ELECTRONICS CO LTD23 citations89
US7939947B2May 10, 2011

Semiconductor package structure

SAMSUNG ELECTRONICS CO LTD10 citations84
US7884875B2Feb 8, 2011

Camera module having lower connection portions defining a chip region and engaging upper connection portions of a lens structure and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD13 citations84
US7777345B2Aug 17, 2010

Semiconductor device having through electrode and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD12 citations84
US7732328B2Jun 8, 2010

Method of fabricating semiconductor package structure

SAMSUNG ELECTRONICS CO LTD13 citations84
US7602047B2Oct 13, 2009

Semiconductor device having through vias

SAMSUNG ELECTRONICS CO LTD13 citations84
US7588964B2Sep 15, 2009

Methods of stacking semiconductor devices and methods of fabricating semiconductor device packages using the same

SAMSUNG ELECTRONICS CO LTD18 citations84
US7825468B2Nov 2, 2010

Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packages

SAMSUNG ELECTRONICS CO LTD6 citations74
US7521657B2Apr 21, 2009

Assembly having wafer with image sensor chips, a photo-sensitive adhesive pattern and plate thereof and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD2 citations62
US7534656B2May 19, 2009

Image sensor device and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD2 citations61
US7371614B2May 13, 2008

Image sensor device and methods thereof

SAMSUNG ELECTRONICS CO LTD2 citations59
US8367472B2Feb 5, 2013

Method of fabricating a 3-D device

SAMSUNG ELECTRONICS CO LTD1 citations52
US8053807B2Nov 8, 2011

Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packages

SAMSUNG ELECTRONICS CO LTD1 citations52

FOUND RES & BUSINESS SEOUL NAT UNIV SCI & TECH

1 patent