Inventor

MA KEUM-HEE

KR16 patents

⚠️ This page may combine multiple inventors who share the name “MA KEUM-HEE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

13 patents

US7777323B2Aug 17, 2010

Semiconductor structure and method for forming the same

SAMSUNG ELECTRONICS CO LTD19 citations92

US7262475B2Aug 28, 2007

Image sensor device and method of manufacturing same

SAMSUNG ELECTRONICS CO LTD30 citations91

US7459774B2Dec 2, 2008

Stacked chip package using photosensitive polymer and manufacturing method thereof

SAMSUNG ELECTRONICS CO LTD23 citations89

US9515057B2Dec 6, 2016

Semiconductor package and method of manufacturing the semiconductor package

SAMSUNG ELECTRONICS CO LTD13 citations84

US9245771B2Jan 26, 2016

Semiconductor packages having through electrodes and methods for fabricating the same

SAMSUNG ELECTRONICS CO LTD8 citations84

US7588964B2Sep 15, 2009

Methods of stacking semiconductor devices and methods of fabricating semiconductor device packages using the same

SAMSUNG ELECTRONICS CO LTD18 citations84

US8373261B2Feb 12, 2013

Chip stack package and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD9 citations83

US7300864B2Nov 27, 2007

Method for forming solder bump structure

SAMSUNG ELECTRONICS CO LTD9 citations74

US7521657B2Apr 21, 2009

Assembly having wafer with image sensor chips, a photo-sensitive adhesive pattern and plate thereof and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD2 citations62

US7534656B2May 19, 2009

Semiconductor chip with signal bump and dummy bump, semiconductor package including the semiconductor chip and method for manufacturing the semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations51

MA KEUM-HEE

1 patent

US8513802B2Aug 20, 2013

Multi-chip package having semiconductor chips of different thicknesses from each other and related device

MA KEUM-HEE14 citations79

LEE KYU-HA

1 patent

US8114772B2Feb 14, 2012

Method of manufacturing the semiconductor device

LEE KYU-HA6 citations64

HWANG SON-KWAN

1 patent

US8183673B2May 22, 2012

Through-silicon via structures providing reduced solder spreading and methods of fabricating the same

HWANG SON-KWAN5 citations58

MA KEUM-HEE

SAMSUNG ELECTRONICS CO LTD

Semiconductor structure and method for forming the same

Image sensor device and method of manufacturing same

Stacked chip package using photosensitive polymer and manufacturing method thereof

Semiconductor package and method of manufacturing the semiconductor package

Semiconductor packages having through electrodes and methods for fabricating the same

Methods of stacking semiconductor devices and methods of fabricating semiconductor device packages using the same

Chip stack package and method of fabricating the same

Method for forming solder bump structure

Assembly having wafer with image sensor chips, a photo-sensitive adhesive pattern and plate thereof and method of manufacturing the same

Image sensor device and method of manufacturing the same

Fabrication method of wafer level chip scale packages

Image sensor device and methods thereof

Semiconductor chip with signal bump and dummy bump, semiconductor package including the semiconductor chip and method for manufacturing the semiconductor package

MA KEUM-HEE

Multi-chip package having semiconductor chips of different thicknesses from each other and related device

LEE KYU-HA

Method of manufacturing the semiconductor device

HWANG SON-KWAN

Through-silicon via structures providing reduced solder spreading and methods of fabricating the same