Inventor
TRIVEDI AJIT
US5 patents
Patents
5 patentsUS6829149B1Dec 7, 2004
Placement of sacrificial solder balls underneath the PBGA substrate
IBM17 citations91
US5959348ASep 28, 1999
Construction of PBGA substrate for flip chip packing
IBM25 citations91
US6353182B1Mar 5, 2002
Proper choice of the encapsulant volumetric CTE for different PGBA substrates
IBM14 citations83
US6255599B1Jul 3, 2001
Relocating the neutral plane in a PBGA substrate to eliminate chip crack and interfacial delamination
IBM12 citations72
US7227268B2Jun 5, 2007
Placement of sacrificial solder balls underneath the PBGA substrate
IBM3 citations61