Inventor

ZHU ZHENGYU

CN3 patents

⚠️ This page may combine multiple inventors who share the name “ZHU ZHENGYU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FAIRCHILD SEMICONDUCTOR

2 patents

US7589338B2Sep 15, 2009

Semiconductor die packages suitable for optoelectronic applications having clip attach structures for angled mounting of dice

FAIRCHILD SEMICONDUCTOR12 citations81

US7825501B2Nov 2, 2010

High bond line thickness for semiconductor devices

FAIRCHILD SEMICONDUCTOR5 citations59

ZHU ZHENGYU

1 patent

US9147665B2Sep 29, 2015

High bond line thickness for semiconductor devices

ZHU ZHENGYU6 citations75