Inventor
CHAE SEUNG-KI
KR28 patents
⚠️ This page may combine multiple inventors who share the name “CHAE SEUNG-KI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
25 patentsUS6039770AMar 21, 2000
Semiconductor device manufacturing system having means for reducing a pressure difference between loadlock and processing chambers
SAMSUNG ELECTRONICS CO LTD47 citations92
US6910954B2Jun 28, 2005
Method of supplying slurry and a slurry supply apparatus having a mixing unit at a point of use
SAMSUNG ELECTRONICS CO LTD29 citations90
US6071350AJun 6, 2000
Semiconductor device manufacturing apparatus employing vacuum system
SAMSUNG ELECTRONICS CO LTD16 citations89
US5833425ANov 10, 1998
Semiconductor device manufacturing apparatus employing vacuum system
SAMSUNG ELECTRONICS CO LTD18 citations89
US6869500B2Mar 22, 2005
Method for processing a wafer and apparatus for performing the same
SAMSUNG ELECTRONICS CO LTD35 citations87
US7951653B1May 31, 2011
Methods of manufacturing a semiconductor device using compositions for etching copper
SAMSUNG ELECTRONICS CO LTD15 citations83
US7556712B2Jul 7, 2009
Laser cleaning of backside of wafer for photolithographic processing
SAMSUNG ELECTRONICS CO LTD19 citations83
US7335601B2Feb 26, 2008
Method of processing an object and method of controlling processing apparatus to prevent contamination of the object
SAMSUNG ELECTRONICS CO LTD9 citations82
US7880138B2Feb 1, 2011
Apparatus and method for analyzing contaminants on wafer
SAMSUNG ELECTRONICS CO LTD9 citations79
US6814835B2Nov 9, 2004
Apparatus and method for supplying chemicals in chemical mechanical polishing systems
SAMSUNG ELECTRONICS CO LTD8 citations72
US5654205AAug 5, 1997
Apparatus and method for depositing particles onto a wafer
SAMSUNG ELECTRONICS CO LTD5 citations71
US8361274B2Jan 29, 2013
Etching apparatus and etching method
SAMSUNG ELECTRONICS CO LTD6 citations70
US7497963B2Mar 3, 2009
Etching method
SAMSUNG ELECTRONICS CO LTD7 citations70
US7985297B2Jul 26, 2011
Method of cleaning a quartz part
SAMSUNG ELECTRONICS CO LTD3 citations60
US5746832AMay 5, 1998
Apparatus for depositing particles onto a wafer
SAMSUNG ELECTRONICS CO LTD3 citations60
US7879736B2Feb 1, 2011
Composition for etching silicon oxide and method of forming a contact hole using the same
SAMSUNG ELECTRONICS CO LTD2 citations59
US7417709B2Aug 26, 2008
Method and apparatus for exposing semiconductor substrates
SAMSUNG ELECTRONICS CO LTD2 citations57
US6602323B2Aug 5, 2003
Method and apparatus for reducing PFC emission during semiconductor manufacture
SAMSUNG ELECTRONICS CO LTD6 citations54
US7265818B2Sep 4, 2007
Method of exposing a wafer to a light, and reticle, reticle assembly and exposing apparatus for performing the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US7170070B2Jan 30, 2007
Ion implanters having an arc chamber that affects ion current density
SAMSUNG ELECTRONICS CO LTD1 citations50
US7687448B2Mar 30, 2010
Composition for removing a photoresist, method of preparing the composition, method of removing a photoresist and method of manufacturing a semiconductor device using the composition
SAMSUNG ELECTRONICS CO LTD0 citations49
US7608540B2Oct 27, 2009
Composition for removing a photoresist, method of preparing the composition, method of removing a photoresist and method of manufacturing a semiconductor device using the composition
SAMSUNG ELECTRONICS CO LTD0 citations49
US7112810B2Sep 26, 2006
Ion implanting apparatus and ion implanting method using the same
SAMSUNG ELECTRONICS CO LTD1 citations47
US7040336B2May 9, 2006
Gas delivery system for supplying gas to semiconductor manufacturing equipment
SAMSUNG ELECTRONICS CO LTD1 citations47
US7976785B2Jul 12, 2011
Apparatus for decomposing perfluorinated compounds and system for processing perfluorinated compounds using the apparatus
SAMSUNG ELECTRONICS CO LTD0 citations45