Inventor

CHEN CHIN-LIANG

TW73 patents

⚠️ This page may combine multiple inventors who share the name “CHEN CHIN-LIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEN CHIN-LIANG

TAIWAN SEMICONDUCTOR MFG CO LTD

Lid design for heat dissipation enhancement of die package

Integrated fan-out package and manufacturing method thereof

Semiconductor packaging structure and process

Semiconductor structure and manufacturing method thereof

Lid structure for a semiconductor device package and method for forming the same

Semiconductor device and manufacturing method thereof

System and method for bonding package lid

Semiconductor package and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Package-on-package with redistribution structure

Semiconductor packages and forming methods thereof

Semiconductor structure and manufacturing method thereof

Package structure and method of manufacturing the same

Semiconductor structure and manufacturing method thereof

Integrated fan-out package and manufacturing method thereof

Semiconductor packages and methods of forming the same

Method for forming a lid structure for a semiconductor device package

Semiconductor packaging structure and process

Integrated circuit packages and methods of forming same

Method of manufacturing a chip package

Packaging methods for semiconductor devices with encapsulant ring

Adhesive pattern for advance package reliability improvement

Semiconductor package and methods of fabricating a semiconductor package

Die corner removal for underfill crack suppression in semiconductor die packaging

Semiconductor packages and forming methods thereof

Semiconductor structure and manufacturing method thereof

Die corner removal for underfill crack suppression in semiconductor die packaging

Semiconductor structure and manufacturing method thereof

Integrated circuit packages and methods of forming same

Method for manufacturing semiconductor structure

Lid attach process and dispenser head

Semiconductor structure and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Integrated fan-out package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Integrated fan-out package and manufacturing method thereof

Semiconductor structure and associated method for manufacturing the same

Semiconductor structure and circuit structure

Semiconductor structure and manufacturing method thereof

Package structure and forming method thereof

LU KUAN-PAO

Illumination device

Illumination lamp

TAIWAN SEMICONDUCTOR MFG

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

WINTEK CORP

Back light module

Flexible printed circuit and liquid crystal module using the same

CHEN CHIN-LIANG

Lid attach process and apparatus for fabrication of semiconductor packages

(unassigned)

Paper retaining structure of a loose-leaf file folder

YE ZHI-TING

Light guide device

Huang ting-chun

Structure of rivet fixing device