Inventor

YUAN HSI-YING

TW4 patents

⚠️ This page may combine multiple inventors who share the name “YUAN HSI-YING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YOUNGTEK ELECTRONICS CORP

1 patent

US11145565B2Oct 12, 2021

Method of fabricating a chip package module with improve heat dissipation effect

YOUNGTEK ELECTRONICS CORP2 citations66

ADVANCED CHIP ENG TECH INC

1 patent

US7476565B2Jan 13, 2009

Method for forming filling paste structure of WL package

ADVANCED CHIP ENG TECH INC3 citations60

HOLIEN TECH CO LTD

1 patent

US10115673B1Oct 30, 2018

Embedded substrate package structure

HOLIEN TECH CO LTD1 citations39

CHIP WIN TECH CO LTD

1 patent

US9810662B1Nov 7, 2017

Structure for integrating microfluidic devices and electrical biosensors

CHIP WIN TECH CO LTD0 citations17