Inventor
CHANG CHIA-HUA
TW28 patents
⚠️ This page may combine multiple inventors who share the name “CHANG CHIA-HUA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
4 patentsUS12490447B2Dec 2, 2025
Semiconductor device and method for forming the same
UNITED MICROELECTRONICS CORP0 citations61
US12453149B2Oct 21, 2025
Fabricating method of semiconductor device
UNITED MICROELECTRONICS CORP0 citations61
US12027602B2Jul 2, 2024
Semiconductor device and method for forming the same
UNITED MICROELECTRONICS CORP1 citations61
US11990518B2May 21, 2024
Semiconductor device and fabricating method thereof
UNITED MICROELECTRONICS CORP0 citations61
TAIWAN SEMICONDUCTOR MFG
3 patentsUS7468327B2Dec 23, 2008
Methods of fabricating a micromechanical structure
TAIWAN SEMICONDUCTOR MFG2 citations62
US7459344B2Dec 2, 2008
Method for forming micromachined structure
TAIWAN SEMICONDUCTOR MFG0 citations51
US7760930B2Jul 20, 2010
Translation engine of defect pattern recognition
TAIWAN SEMICONDUCTOR MFG0 citations50
TAIWAN SEMICONDUCTOR MFG CO LTD
3 patentsUS11899367B2Feb 13, 2024
Dummy insertion for improving throughput of electron beam lithography
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11526081B2Dec 13, 2022
Dummy insertion for improving throughput of electron beam lithography
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11054748B2Jul 6, 2021
Dummy insertion for improving throughput of electron beam lithography
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
CHANG YI
2 patentsCHUNG SHAN INST OF SCIENCE
2 patentsUS7270732B2Sep 18, 2007
Method for enhancing bonding strength of a metal spraying thickened layer of electroformed mold inserts
CHUNG SHAN INST OF SCIENCE3 citations56
US7117577B2Oct 10, 2006
Method of fastening mold shell with mold seat without risk of causing mold shell to crack
CHUNG SHAN INST OF SCIENCE1 citations47