Inventor
OSBORN PHILIP R
US18 patents
⚠️ This page may combine multiple inventors who share the name “OSBORN PHILIP R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TESSERA INC
11 patentsUS9224717B2Dec 29, 2015
Package-on-package assembly with wire bonds to encapsulation surface
TESSERA INC76 citations97
US9093435B2Jul 28, 2015
Package-on-package assembly with wire bonds to encapsulation surface
TESSERA INC68 citations97
US7994622B2Aug 9, 2011
Microelectronic packages having cavities for receiving microelectric elements
TESSERA INC37 citations96
US10062661B2Aug 28, 2018
Package-on-package assembly with wire bonds to encapsulation surface
TESSERA INC5 citations84
US10593643B2Mar 17, 2020
Package-on-package assembly with wire bonds to encapsulation surface
TESSERA INC1 citations73
US9691731B2Jun 27, 2017
Package-on-package assembly with wire bonds to encapsulation surface
TESSERA INC1 citations62
US7268304B2Sep 11, 2007
Microelectronic connection components having bondable wires
TESSERA INC3 citations59
US10833044B2Nov 10, 2020
Package-on-package assembly with wire bonds to encapsulation surface
TESSERA INC0 citations52
US9633968B2Apr 25, 2017
Microelectronic packages having cavities for receiving microelectronic elements
TESSERA INC0 citations52
US9105612B2Aug 11, 2015
Microelectronic packages having cavities for receiving microelectronic elements
TESSERA INC0 citations52
US8816514B2Aug 26, 2014
Microelectronic assembly with joined bond elements having lowered inductance
TESSERA INC0 citations52