P

Inventor

CHO JUNG HYUN

KR107 patents
⚠️ This page may combine multiple inventors who share the name “CHO JUNG HYUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRO MECH

16 patents
US10347598B2Jul 9, 2019

Composite antenna substrate and semiconductor package module

SAMSUNG ELECTRO MECH22 citations94
US10026678B1Jul 17, 2018

Fan-out semiconductor package

SAMSUNG ELECTRO MECH8 citations83
US11488906B2Nov 1, 2022

Bridge embedded interposer, and package substrate and semiconductor package comprising the same

SAMSUNG ELECTRO MECH6 citations74
US11178761B1Nov 16, 2021

Printed circuit board and method of manufacturing the same

SAMSUNG ELECTRO MECH5 citations73
US10477683B2Nov 12, 2019

Printed circuit board including sub-circuit board

SAMSUNG ELECTRO MECH2 citations73
US10109541B2Oct 23, 2018

Board for electronic component package, electronic component package, and method of manufacturing board for electronic component package

SAMSUNG ELECTRO MECH5 citations73
US10061967B2Aug 28, 2018

Fan-out semiconductor package

SAMSUNG ELECTRO MECH3 citations73
US9999141B2Jun 12, 2018

Printed circuit board and method for manufacturing the same

SAMSUNG ELECTRO MECH2 citations73
US9837343B2Dec 5, 2017

Chip embedded substrate

SAMSUNG ELECTRO MECH5 citations73
US9831142B2Nov 28, 2017

Board for electronic component package, electronic component package, and method of manufacturing board for electronic component package

SAMSUNG ELECTRO MECH3 citations73
US9578749B2Feb 21, 2017

Element embedded printed circuit board and method of manufacturing the same

SAMSUNG ELECTRO MECH3 citations73
US10256192B2Apr 9, 2019

Fan-out semiconductor package

SAMSUNG ELECTRO MECH5 citations72
US10925161B2Feb 16, 2021

Printed circuit board

SAMSUNG ELECTRO MECH2 citations71
US10153235B2Dec 11, 2018

Image sensor device and image sensor module comprising the same

SAMSUNG ELECTRO MECH3 citations71
US11997801B2May 28, 2024

Printed circuit board

SAMSUNG ELECTRO MECH0 citations62
US10283439B2May 7, 2019

Fan-out semiconductor package including electromagnetic interference shielding layer

SAMSUNG ELECTRO MECH1 citations62

SAMSUNG ELECTRONICS CO LTD

8 patents

SAMSUNG DISPLAY CO LTD

7 patents

LG ELECTRONICS INC

5 patents

ELECTRONICS & TELECOMMUNICATIONS RES INST

3 patents

RESEARCH IN MOTION LTD

2 patents

(unassigned)

1 patent

CHEIL IND INC

1 patent

CHO JUNG-HYUN

1 patent

FASOO COM CO LTD

1 patent

CHO JUNG HYUN

1 patent

HANON SYSTEMS

1 patent

ROH DONG WOOK

1 patent

CERAGEM CO LTD

1 patent

ROH DONGWOOK

1 patent

Showing the top 50 of 107 patents by PatentIndex Score.