P

Inventor

YAMAKAWA KIMIO

JP29 patents
⚠️ This page may combine multiple inventors who share the name “YAMAKAWA KIMIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DOW CORNING TORAY SILICONE

26 patents
US6304000B1Oct 16, 2001

Semiconductor device comprising silicone adhesive sheet

DOW CORNING TORAY SILICONE88 citations97
US6235862B1May 22, 2001

Adhesive silicone sheet, method for the preparation thereof and semiconductor devices

DOW CORNING TORAY SILICONE69 citations96
US5907190AMay 25, 1999

Semiconductor device having a cured silicone coating with non uniformly dispersed filler

DOW CORNING TORAY SILICONE72 citations93
US6621173B1Sep 16, 2003

Semiconductor device having an adhesive and a sealant

DOW CORNING TORAY SILICONE21 citations92
US6551676B1Apr 22, 2003

Silicone-based adhesive sheet method for manufacturing same and semiconductor device

DOW CORNING TORAY SILICONE27 citations92
US6518204B2Feb 11, 2003

Curable organopolysiloxane composition and method of manufacturing semiconductor devices with the use of the aforementioned composition

DOW CORNING TORAY SILICONE19 citations92
US6513680B2Feb 4, 2003

Paste dispensing container

DOW CORNING TORAY SILICONE20 citations92
US6379792B1Apr 30, 2002

Silicone adhesive sheet and method for manufacturing

DOW CORNING TORAY SILICONE43 citations92
US6225433B1May 1, 2001

Curable silicone composition and electronic components

DOW CORNING TORAY SILICONE29 citations92
US6025435AFeb 15, 2000

Thermal conductive silicone rubber composition

DOW CORNING TORAY SILICONE52 citations92
US5958176ASep 28, 1999

Electrical parts and method for manufacturing the same

DOW CORNING TORAY SILICONE20 citations92
US5877228AMar 2, 1999

Method for curing ultraviolet-curable silicone compositions

DOW CORNING TORAY SILICONE19 citations91
US5561329AOct 1, 1996

Compositions for protecting semiconductor elements and semiconductor devices

DOW CORNING TORAY SILICONE26 citations91
US5891969AApr 6, 1999

Epoxy resin and epoxy-functional organopolysiloxane

DOW CORNING TORAY SILICONE29 citations90
US6750550B1Jun 15, 2004

Adhesive and semiconductor devices

DOW CORNING TORAY SILICONE8 citations74
US6720083B2Apr 13, 2004

Adhesive and semiconductor devices

DOW CORNING TORAY SILICONE5 citations74
US6410642B1Jun 25, 2002

Adhesive and semiconductor devices

DOW CORNING TORAY SILICONE11 citations74
US6040395AMar 21, 2000

Electrical components and method for the fabrication thereof

DOW CORNING TORAY SILICONE10 citations74
US5872194AFeb 16, 1999

Curable liquid-form composition, cured product of the same, and electronic part

DOW CORNING TORAY SILICONE16 citations74
US6761947B2Jul 13, 2004

Silicone-based adhesive sheet, method for manufacturing same, and semiconductor device

DOW CORNING TORAY SILICONE11 citations73
US6498400B2Dec 24, 2002

Semiconductor devices

DOW CORNING TORAY SILICONE5 citations73
US6231974B1May 15, 2001

Hot-melt adhesive sheet and semiconductor devices

DOW CORNING TORAY SILICONE13 citations73
US5989942ANov 23, 1999

Method for fabricating semiconductor device

DOW CORNING TORAY SILICONE15 citations71
US5708054AJan 13, 1998

Two-part curable liquid silicone composition

DOW CORNING TORAY SILICONE11 citations71
US5958515ASep 28, 1999

Electrical components and method for the fabrication thereof

DOW CORNING TORAY SILICONE2 citations63
US7375158B2May 20, 2008

Thermoconductive curable liquid polymer composition and semiconductor device produced with the use of this composition

DOW CORNING TORAY SILICONE0 citations52

TORAY SILICONE CO

2 patents

NIHON HANDA CO LTD

1 patent