Inventor
HAN SANGUK
KR9 patents
Patents
9 patentsUS11923342B2Mar 5, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations72
US11574873B2Feb 7, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations72
US11444060B2Sep 13, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD4 citations72
US12087696B2Sep 10, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US11869818B2Jan 9, 2024
Chip-stacked semiconductor package and method of manufacturing same
SAMSUNG ELECTRONICS CO LTD0 citations60
US11328966B2May 10, 2022
Chip-stacked semiconductor package and method of manufacturing same
SAMSUNG ELECTRONICS CO LTD0 citations60
US11842945B2Dec 12, 2023
Chip on film package and display apparatus including the same
SAMSUNG ELECTRONICS CO LTD0 citations59
US12148337B2Nov 19, 2024
Chip on film package with trench to reduce slippage and display device including the same
SAMSUNG ELECTRONICS CO LTD0 citations58
US12230576B2Feb 18, 2025
Chip-on-film package and display apparatus including the same
SAMSUNG ELECTRONICS CO LTD0 citations57