P

Inventor

BOO JAE-PHIL

KR22 patents
⚠️ This page may combine multiple inventors who share the name “BOO JAE-PHIL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

16 patents
US6383882B1May 7, 2002

Method for fabricating MOS transistor using selective silicide process

SAMSUNG ELECTRONICS CO LTD113 citations97
US6626968B2Sep 30, 2003

Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the same

SAMSUNG ELECTRONICS CO LTD53 citations96
US6652362B2Nov 25, 2003

Apparatus for polishing a semiconductor wafer and method therefor

SAMSUNG ELECTRONICS CO LTD21 citations91
US7196010B2Mar 27, 2007

Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the same

SAMSUNG ELECTRONICS CO LTD16 citations84
US6840846B2Jan 11, 2005

Polishing station of a chemical mechanical polishing apparatus

SAMSUNG ELECTRONICS CO LTD16 citations83
US7303466B2Dec 4, 2007

Carrier head of chemical mechanical polishing apparatus having barriers dividing pressure chamber into a plurality of pressure zones

SAMSUNG ELECTRONICS CO LTD13 citations77
US7052368B2May 30, 2006

Polishing pad for chemical mechanical polishing apparatus

SAMSUNG ELECTRONICS CO LTD10 citations73
US6945861B2Sep 20, 2005

Polishing head of chemical mechanical polishing apparatus and polishing method using the same

SAMSUNG ELECTRONICS CO LTD8 citations73
US6881135B2Apr 19, 2005

Polishing head of chemical mechanical polishing apparatus and polishing method using the same

SAMSUNG ELECTRONICS CO LTD5 citations73
US6769973B2Aug 3, 2004

Polishing head of chemical mechanical polishing apparatus and polishing method using the same

SAMSUNG ELECTRONICS CO LTD12 citations73
US7223158B2May 29, 2007

Method for polishing a semiconductor wafer

SAMSUNG ELECTRONICS CO LTD4 citations72
US7081045B2Jul 25, 2006

Apparatus for polishing a semiconductor wafer

SAMSUNG ELECTRONICS CO LTD7 citations72
US6921323B2Jul 26, 2005

Apparatus for polishing a semiconductor wafer and method therefor

SAMSUNG ELECTRONICS CO LTD7 citations72
US6709920B2Mar 23, 2004

Method of fabricating a non-volatile memory device having a tunnel-insulating layer including more than two portions of different thickness

SAMSUNG ELECTRONICS CO LTD10 citations72
US7196011B2Mar 27, 2007

Apparatus and method for treating substrates

SAMSUNG ELECTRONICS CO LTD6 citations53
US9620392B2Apr 11, 2017

Single type apparatus for drying a substrate and single type system for cleaning a substrate including the same

SAMSUNG ELECTRONICS CO LTD0 citations36

CHANG ONE-MOON

2 patents

LEE SEH KWANG

2 patents

SEO KEON SIK

1 patent

BOO JAE PHIL

1 patent