Inventor
BOO JAE-PHIL
KR22 patents
⚠️ This page may combine multiple inventors who share the name “BOO JAE-PHIL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
16 patentsUS6383882B1May 7, 2002
Method for fabricating MOS transistor using selective silicide process
SAMSUNG ELECTRONICS CO LTD113 citations97
US6626968B2Sep 30, 2003
Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD53 citations96
US6652362B2Nov 25, 2003
Apparatus for polishing a semiconductor wafer and method therefor
SAMSUNG ELECTRONICS CO LTD21 citations91
US7196010B2Mar 27, 2007
Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD16 citations84
US6840846B2Jan 11, 2005
Polishing station of a chemical mechanical polishing apparatus
SAMSUNG ELECTRONICS CO LTD16 citations83
US7303466B2Dec 4, 2007
Carrier head of chemical mechanical polishing apparatus having barriers dividing pressure chamber into a plurality of pressure zones
SAMSUNG ELECTRONICS CO LTD13 citations77
US7052368B2May 30, 2006
Polishing pad for chemical mechanical polishing apparatus
SAMSUNG ELECTRONICS CO LTD10 citations73
US6945861B2Sep 20, 2005
Polishing head of chemical mechanical polishing apparatus and polishing method using the same
SAMSUNG ELECTRONICS CO LTD8 citations73
US6881135B2Apr 19, 2005
Polishing head of chemical mechanical polishing apparatus and polishing method using the same
SAMSUNG ELECTRONICS CO LTD5 citations73
US6769973B2Aug 3, 2004
Polishing head of chemical mechanical polishing apparatus and polishing method using the same
SAMSUNG ELECTRONICS CO LTD12 citations73
US7223158B2May 29, 2007
Method for polishing a semiconductor wafer
SAMSUNG ELECTRONICS CO LTD4 citations72
US7081045B2Jul 25, 2006
Apparatus for polishing a semiconductor wafer
SAMSUNG ELECTRONICS CO LTD7 citations72
US6921323B2Jul 26, 2005
Apparatus for polishing a semiconductor wafer and method therefor
SAMSUNG ELECTRONICS CO LTD7 citations72
US6709920B2Mar 23, 2004
Method of fabricating a non-volatile memory device having a tunnel-insulating layer including more than two portions of different thickness
SAMSUNG ELECTRONICS CO LTD10 citations72
US7196011B2Mar 27, 2007
Apparatus and method for treating substrates
SAMSUNG ELECTRONICS CO LTD6 citations53
US9620392B2Apr 11, 2017
Single type apparatus for drying a substrate and single type system for cleaning a substrate including the same
SAMSUNG ELECTRONICS CO LTD0 citations36