Inventor
ZHU HONGBIN
CN92 patents
⚠️ This page may combine multiple inventors who share the name “ZHU HONGBIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
22 patentsUS10090318B2Oct 2, 2018
Vertical string of memory cells individually comprising a programmable charge storage transistor comprising a control gate and a charge storage structure and method of forming a vertical string of memory cells individually comprising a programmable charge storage transistor comprising a control gate and a charge storage structure
MICRON TECHNOLOGY INC23 citations93
US9431410B2Aug 30, 2016
Methods and apparatuses having memory cells including a monolithic semiconductor channel
MICRON TECHNOLOGY INC15 citations92
US10242995B2Mar 26, 2019
Drain select gate formation methods and apparatus
MICRON TECHNOLOGY INC8 citations84
US9613973B2Apr 4, 2017
Memory having a continuous channel
MICRON TECHNOLOGY INC5 citations84
US9048194B2Jun 2, 2015
Method for selectively modifying spacing between pitch multiplied structures
MICRON TECHNOLOGY INC12 citations84
US8030218B2Oct 4, 2011
Method for selectively modifying spacing between pitch multiplied structures
MICRON TECHNOLOGY INC12 citations84
US9659949B2May 23, 2017
Integrated structures
MICRON TECHNOLOGY INC9 citations83
US11088168B2Aug 10, 2021
Semiconductor devices and methods of fabrication
MICRON TECHNOLOGY INC2 citations73
US10608004B2Mar 31, 2020
Semiconductor devices and methods of fabrication
MICRON TECHNOLOGY INC2 citations73
US10553611B2Feb 4, 2020
Memory arrays and methods of fabricating integrated structure
MICRON TECHNOLOGY INC1 citations73
US10090317B2Oct 2, 2018
Methods and apparatuses having memory cells including a monolithic semiconductor channel
MICRON TECHNOLOGY INC3 citations73
US10038002B2Jul 31, 2018
Semiconductor devices and methods of fabrication
MICRON TECHNOLOGY INC3 citations73
US10269819B2Apr 23, 2019
Integrated structures and methods of forming vertically-stacked memory cells
MICRON TECHNOLOGY INC3 citations72
US10446507B2Oct 15, 2019
Semiconductor devices and semiconductor dice including electrically conductive interconnects between die rings
MICRON TECHNOLOGY INC2 citations68
US12279420B2Apr 15, 2025
Memory having a continuous channel
MICRON TECHNOLOGY INC0 citations63
US12052863B2Jul 30, 2024
Memory circuitry comprising a vertical string of memory cells and a conductive via and method used in forming a vertical string of memory cells and a conductive via
MICRON TECHNOLOGY INC0 citations63
US11315941B2Apr 26, 2022
Memory having a continuous channel
MICRON TECHNOLOGY INC0 citations63
US10446571B2Oct 15, 2019
Memory circuitry comprising a vertical string of memory cells and a conductive via and method used in forming a vertical string of memory cells and a conductive via
MICRON TECHNOLOGY INC1 citations63
US9935120B2Apr 3, 2018
Methods of fabricating integrated structures
MICRON TECHNOLOGY INC1 citations63
US9287379B2Mar 15, 2016
Memory arrays
MICRON TECHNOLOGY INC1 citations63
US7898019B2Mar 1, 2011
Semiconductor constructions having multiple patterned masking layers over NAND gate stacks
MICRON TECHNOLOGY INC3 citations63
US7476588B2Jan 13, 2009
Methods of forming NAND cell units with string gates of various widths
MICRON TECHNOLOGY INC3 citations63
YANGTZE MEMORY TECH CO LTD
19 patentsUS10566336B1Feb 18, 2020
Three-dimensional memory devices having through array contacts and methods for forming the same
YANGTZE MEMORY TECH CO LTD11 citations93
US11205659B2Dec 21, 2021
Interconnect structures of three-dimensional memory devices
YANGTZE MEMORY TECH CO LTD8 citations84
US12170258B2Dec 17, 2024
Memory devices having vertical transistors and methods for forming the same
YANGTZE MEMORY TECH CO LTD3 citations74
US12080665B2Sep 3, 2024
Memory devices having vertical transistors and methods for forming the same
YANGTZE MEMORY TECH CO LTD2 citations73
US11114453B2Sep 7, 2021
Bonded memory device and fabrication methods thereof
YANGTZE MEMORY TECH CO LTD2 citations73
US11004948B2May 11, 2021
Three-dimensional memory devices and methods for forming the same
YANGTZE MEMORY TECH CO LTD2 citations73
US12176310B2Dec 24, 2024
Memory devices having vertical transistors and methods for forming the same
YANGTZE MEMORY TECH CO LTD2 citations72
US11532636B2Dec 20, 2022
Three-dimensional memory devices having through array contacts and methods for forming the same
YANGTZE MEMORY TECH CO LTD1 citations72
US11043505B2Jun 22, 2021
Three-dimensional memory device having multi-deck structure and methods for forming the same
YANGTZE MEMORY TECH CO LTD2 citations72
US10818631B2Oct 27, 2020
Semiconductor structure and method of forming the same
YANGTZE MEMORY TECH CO LTD3 citations69
US10811380B2Oct 20, 2020
Semiconductor structure and forming method thereof
YANGTZE MEMORY TECH CO LTD3 citations69
US10790297B2Sep 29, 2020
Method for forming channel hole in three-dimensional memory device using nonconformal sacrificial layer
YANGTZE MEMORY TECH CO LTD4 citations68
US12408338B2Sep 2, 2025
Memory devices having vertical transistors and methods for forming the same
YANGTZE MEMORY TECH CO LTD1 citations64
US12349341B2Jul 1, 2025
Memory devices having vertical transistors and methods for forming the same
YANGTZE MEMORY TECH CO LTD1 citations63
US11805647B2Oct 31, 2023
Three-dimensional memory device having epitaxially-grown semiconductor channel and method for forming the same
YANGTZE MEMORY TECH CO LTD0 citations63
US11647629B2May 9, 2023
Three-dimensional memory devices and methods for forming the same
YANGTZE MEMORY TECH CO LTD0 citations63
US11581328B2Feb 14, 2023
Three-dimensional memory device having epitaxially grown single crystalline silicon channel
YANGTZE MEMORY TECH CO LTD0 citations63
US11127758B2Sep 21, 2021
Three-dimensional memory devices and methods for forming the same
YANGTZE MEMORY TECH CO LTD0 citations63
US11127755B2Sep 21, 2021
Three-dimensional memory devices and methods for forming the same
YANGTZE MEMORY TECH CO LTD0 citations63
INTEL CORP
6 patentsUS10134758B2Nov 20, 2018
Memory devices and systems having reduced bit line to drain select gate shorting and associated methods
INTEL CORP6 citations84
US9741734B2Aug 22, 2017
Memory devices and systems having reduced bit line to drain select gate shorting and associated methods
INTEL CORP8 citations84
US9595531B2Mar 14, 2017
Aluminum oxide landing layer for conductive channels for a three dimensional circuit device
INTEL CORP12 citations83
US10707121B2Jul 7, 2020
Solid state memory device, and manufacturing method thereof
INTEL CORP9 citations80
US10504859B2Dec 10, 2019
Electronic component guard ring
INTEL CORP3 citations73
US11018097B2May 25, 2021
Electronic component guard ring
INTEL CORP0 citations63
LIM CHAN
1 patentUNIV AUBURN
1 patentSHENZHEN YOLANDA TECH CO LTD
1 patentShowing the top 50 of 92 patents by PatentIndex Score.