Inventor

CHENG WEIHUA

CN28 patents

⚠️ This page may combine multiple inventors who share the name “CHENG WEIHUA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHENG WEIHUA

YANGTZE MEMORY TECH CO LTD

Hybrid bonding contact structure of three-dimensional memory device

Bonded semiconductor devices having processor and dynamic random-access memory and methods for forming the same

Bonded semiconductor devices having processor and dynamic random-access memory and methods for forming the same

Unified semiconductor devices having processor and heterogeneous memories and methods for forming the same

Unified semiconductor devices having programmable logic device and heterogeneous memories and methods for forming the same

Hybrid bonding contact structure of three-dimensional memory device

Hybrid bonding contact structure of three-dimensional memory device

Unified semiconductor devices having processor and heterogeneous memories and methods for forming the same

Bonded semiconductor devices having programmable logic device and dynamic random-access memory and methods for forming the same

Hybrid bonding contact structure of three-dimensional memory device

Bonded unified semiconductor chips and fabrication and operation methods thereof

Bonded semiconductor devices having programmable logic device and NAND flash memory and methods for forming the same

Semiconductor structure and method of forming the same

Semiconductor structure and forming method thereof

Method for forming channel hole in three-dimensional memory device using nonconformal sacrificial layer

Unified semiconductor devices having processor and heterogeneous memories and methods for forming the same

Hybrid bonding contact structure of three-dimensional memory device

Bonded semiconductor devices having processor and dynamic random-access memory and methods for forming the same

Bonded semiconductor devices having programmable logic device and dynamic random-access memory and methods for forming the same

Bonded semiconductor devices having processor and NAND flash memory and methods for forming the same

Unified semiconductor devices having processor and heterogeneous memories and methods for forming the same

Bonded unified semiconductor chips and fabrication and operation methods thereof

Bonded semiconductor devices having processor and NAND flash memory and methods for forming the same

Method of forming semiconductor structure

Bonded semiconductor devices having programmable logic device and NAND flash memory and methods for forming the same

Three-dimensional memory devices with channel structures having plum blossom shape

Methods for forming three-dimensional memory devices with channel structures having plum blossom shape

WUHAN XINXIN SEMICONDUCTOR MFG

Semiconductor cooling method and method of heat dissipation