Inventor

ICHIKAWA IWAO

JP11 patents

⚠️ This page may combine multiple inventors who share the name “ICHIKAWA IWAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SONY CORP

7 patents

US5698068ADec 16, 1997

Thermocompression bonding equipment

SONY CORP32 citations92

US5439161AAug 8, 1995

Thermocompression bonding apparatus, thermocompression bonding method and process of manufacturing liquid crystal display device

SONY CORP50 citations92

US4457451AJul 3, 1984

Apparatus for feeding electric circuit elements

SONY CORP29 citations92

US4451324AMay 29, 1984

Apparatus for placing chip type circuit elements on a board

SONY CORP49 citations88

US4336872AJun 29, 1982

Apparatus for transferring parts or the like

SONY CORP19 citations80

US4460108AJul 17, 1984

Apparatus for feeding electric circuit elements

SONY CORP22 citations79

US4345371AAug 24, 1982

Method and apparatus for manufacturing hybrid integrated circuits

SONY CORP26 citations79

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

4 patents

US5568264AOct 22, 1996

Exterior view inspecting apparatus for circuit board

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD23 citations90

US5787191AJul 28, 1998

Wiring pattern inspection apparatus for printed circuit board

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD10 citations72

US5459795AOct 17, 1995

Wiring pattern inspection apparatus for printed circuit board

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD4 citations61

US6618135B2Sep 9, 2003

Laser beam inspection apparatus

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD1 citations51