Inventor

GOH HIN HWA

SG30 patents

⚠️ This page may combine multiple inventors who share the name “GOH HIN HWA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GOH HIN HWA

STATS CHIPPAC LTD

Semiconductor device and method of placing semiconductor die on a temporary carrier using fiducial patterns

Etched leadframe flipchip package system

Semiconductor device and method of controlling warpage in reconstituted wafer

Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern

Semiconductor device and method of making TSV interconnect structures using encapsulant for structural support

Etched leadframe flipchip package system

Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief

Semiconductor device and method of forming FO-WLCSP with multiple encapsulants

Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief

Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief

STATS CHIPPAC PTE LTD

Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern

Semiconductor device and method of controlling warpage in reconstituted wafer

Semiconductor device and method of stacking hybrid substrates with embedded electric components

Semiconductor device and method of forming hybrid substrate with uniform thickness

Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern

Semiconductor device and method of controlling warpage in reconstituted wafer

LIN YAOJIAN

Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief

Semiconductor device and method of forming FO-WLCSP with multiple encapsulants

CHOW SENG GUAN

Integrated circuit packaging system with package-on-package and method of manufacture thereof

Integrated circuit packaging system with encapsulation connector and method of manufacture thereof

SUTHIWONGSUNTHORN NATHAPONG

Semiconductor device having an interconnect structure with TSV using encapsulant for structural support

Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural support

CHIPPAC INC

Semiconductor flip chip package having substantially non-collapsible spacer

CHEN KANG

Integrated circuit packaging system with active surface heat removal and method of manufacture thereof

LEE JAE SOO

Semiconductor flip chip package having substantially non-collapsible spacer and method of manufacture thereof

HSIAO YUNG KUAN

Integrated circuit packaging system with warpage control and method of manufacture thereof

OMANDAM GLENN

Semiconductor device and method of laser-marking laminate layer formed over eWLB with tape applied to opposite surface

DO BYUNG TAI

Semiconductor device and method of providing common voltage bus and wire bondable redistribution

GOH HIN HWA

Integrated circuit packaging system with warpage control and method of manufacture thereof

HUANG RUI

Integrated circuit packaging system with a substrate embedded dummy-die paddle and method of manufacture thereof