Inventor

TU JUNG-KUO

TW29 patents

⚠️ This page may combine multiple inventors who share the name “TU JUNG-KUO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TU JUNG-KUO

TAIWAN SEMICONDUCTOR MFG CO LTD

Air trench in packages incorporating hybrid bonding

Package structure and methods of forming same

Air trench in packages incorporating hybrid bonding

Image sensor device and method

MEMS device and manufacturing method thereof

Method of forming dielectric and metal sealing layers on capping structure of a MEMs device

Semiconductor structure and manufacturing method for the same

Method for manufacturing semiconductor structure

Semiconductor structure and method for forming the same

Semiconductor structure and method for manufacturing thereof

Semiconductor device and manufacturing method of semiconductor device

Method of fabricating semiconductor structure

MEMS device and method for making the same

Micro electro mechanical system (MEMs) device having metal sealing on necking portion of vent hole

Method for manufacturing semiconductor device

Layer for buffer semiconductor device including microelectromechnical system (MEMS) device

Image sensor device and method

Image sensor device and method

Air trench in packages incorporating hybrid bonding

Capacitive sensors and methods for forming the same

Substrate structure, semiconductor structure and method for fabricating the same

Method of fabricating MEMS devices having a plurality of cavities

Micro-electromechanical systems (MEMS) device with outgas layer

TAIWAN SEMICONDUCTOR MFG

Package structure and methods of forming same

Image sensor device and method

Image sensor device and method

Capacitive sensors and methods for forming the same

MEMS devices having a plurality of cavities

CHOU BRUCE C S

Capacitive sensors and methods for forming the same