Inventor

MOROZUMI AKIRA

JP23 patents

⚠️ This page may combine multiple inventors who share the name “MOROZUMI AKIRA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MOROZUMI AKIRA

FUJI ELECTRIC CO LTD

Power semiconductor module ceramic substrate with upper and lower plates attached to a metal base

Insulation substrate for a semiconductor device

Semiconductor device and method of relaxing thermal stress

Zirconia-added alumina substrate with direct bonding of copper

Cooling device for semiconductor module, and semiconductor module

Method of manufacturing semiconductor device

Semiconductor module and manufacturing method of semiconductor module

Semiconductor device having a cooler

Method for manufacturing a semiconductor device

Power semiconductor module

Semiconductor module with reinforcing board

Semiconductor device and method of manufacturing semiconductor device

GOHARA HIROMICHI

Semiconductor module cooler and semiconductor module

Semiconductor module and cooler

Semiconductor module and cooling unit

Semiconductor module cooler and semiconductor module

FUJI ELECTRIC SYSTEMS CO LTD

Manufacturing method of semiconductor device

Method for producing a semiconductor device using a solder alloy

IKEDA YOSHINARI

Semiconductor device

HONDA MOTOR CO LTD

Semiconductor device

SOYANO SHIN

Semiconductor module and heat radiation member

NISHIMURA YOSHITAKA

Method for producing semiconductor device

FUJI ELEC DEVICE TECH CO LTD

Semiconductor device and manufacturing method thereof