Inventor
BAE SUK SU
KR4 patents
Patents
4 patentsUS6815257B2Nov 9, 2004
Chip scale package and method of fabricating the same
SAMSUNG ELECTRO MECH95 citations95
US6841416B2Jan 11, 2005
Chip scale package and method of fabricating the same
SAMSUNG ELECTRO MECH7 citations71
US7176058B2Feb 13, 2007
Chip scale package and method of fabricating the same
SAMSUNG ELECTRO MECH3 citations60
US7071570B2Jul 4, 2006
Chip scale package and method of fabricating the same
SAMSUNG ELECTRO MECH0 citations49