Inventor

TE BUN CHAY

US6 patents

⚠️ This page may combine multiple inventors who share the name “TE BUN CHAY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HEWLETT PACKARD CO

2 patents

US6586112B1Jul 1, 2003

Mandrel and orifice plates electroformed using the same

HEWLETT PACKARD CO28 citations89

US6315385B1Nov 13, 2001

Self-locating orifice plate construction for thermal ink jet printheads

HEWLETT PACKARD CO8 citations70

HEWLETT PACKARD DEVELOPMENT CO

2 patents

US7346915B2Mar 18, 2008

Compact and portable optical disc drive

HEWLETT PACKARD DEVELOPMENT CO4 citations61

US6854829B2Feb 15, 2005

Laser-actuatable inkjet printing system and printer

HEWLETT PACKARD DEVELOPMENT CO5 citations59

SOLIDSCAPE INC

2 patents

US9895847B2Feb 20, 2018

Method and apparatus for fabricating three dimensional models

SOLIDSCAPE INC1 citations47

US9427773B2Aug 30, 2016

Method for simultaneously scribing and filling of scribed channel, trough, trench or groove

SOLIDSCAPE INC0 citations47