Inventor
PARK JASON DAEJIN
US7 patents
⚠️ This page may combine multiple inventors who share the name “PARK JASON DAEJIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
6 patentsUS11049716B2Jun 29, 2021
Gap fill using carbon-based films
LAM RES CORP11 citations83
US9741584B1Aug 22, 2017
Densification of dielectric film using inductively coupled high density plasma
LAM RES CORP14 citations83
US10023956B2Jul 17, 2018
Eliminating first wafer metal contamination effect in high density plasma chemical vapor deposition systems
LAM RES CORP8 citations82
US10615169B2Apr 7, 2020
Selective deposition of SiN on horizontal surfaces
LAM RES CORP5 citations71
US9406544B1Aug 2, 2016
Systems and methods for eliminating seams in atomic layer deposition of silicon dioxide film in gap fill applications
LAM RES CORP2 citations62
US10224235B2Mar 5, 2019
Systems and methods for creating airgap seals using atomic layer deposition and high density plasma chemical vapor deposition
LAM RES CORP1 citations61