Inventor · disambiguated record
Tammy Lynn Petriwsky
Also filed as: PETRIWSKY TAMMY LYNN
7 granted patents·2 pending applications·67 citations·filing 2014–2022
84Inventor score
Files withCORNING INC9
Top patents by PatentIndex Score
9 records- 0194US9656909B2Methods for forming vias in glass substratesCORNING INC·Filed 2015·Granted May 23, 2017·17 cites·10 claims
- 0292US9296646B2Methods for forming vias in glass substratesCORNING INC·Filed 2014·Granted Mar 29, 2016·19 cites·17 claims
- 0391US9745220B2Etch rate enhancement at low temperaturesCORNING INC·Filed 2014·Granted Aug 29, 2017·16 cites·8 claims
- 0489US10879182B2Assembly substrates including through hole vias and methods for making suchCORNING INC·Filed 2018·Granted Dec 29, 2020·8 cites·17 claims
- 0584US10239782B2Method for controlling surface features on glass-ceramic articles and articles formed therefromCORNING INC·Filed 2016·Granted Mar 26, 2019·3 cites·14 claims
- 0679US10077206B2Methods of etching glass substrates and glass substratesCORNING INC·Filed 2016·Granted Sep 18, 2018·4 cites·15 claims
- 0767US12012353B2Method for controlling surface features on glass-ceramic articles and articles formed therefromCORNING INC·Filed 2019·Granted Jun 18, 2024·0 cites·18 claims
- 0861US2023174423A1Glass wafer with through glass viasCORNING INC·Filed 2022·Application pending·0 cites
- 0950US2020354262A1High silicate glass articles possessing through glass vias and methods of making and using thereofCORNING INC·Filed 2020·Application pending·0 cites
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