Inventor
HAURYLAU MIKHAIL
US8 patents
Patents
8 patentsUS9709510B2Jul 18, 2017
Determining a configuration for an optical element positioned in a collection aperture during wafer inspection
KLA TENCOR CORP23 citations90
US9989479B1Jun 5, 2018
System and method to determine depth for optical wafer inspection
KLA TENCOR CORP6 citations81
US9389349B2Jul 12, 2016
System and method to determine depth for optical wafer inspection
KLA TENCOR CORP12 citations81
US10317347B2Jun 11, 2019
Determining information for defects on wafers
KLA TENCOR CORP2 citations70
US9645093B2May 9, 2017
System and method for apodization in a semiconductor device inspection system
KLA TENCOR CORP3 citations69
US9176069B2Nov 3, 2015
System and method for apodization in a semiconductor device inspection system
KLA TENCOR CORP5 citations69
US10571407B2Feb 25, 2020
Determining information for defects on wafers
KLA TENCOR CORP0 citations49
US10215713B2Feb 26, 2019
Determining a configuration for an optical element positioned in a collection aperture during wafer inspection
KLA TENCOR CORP0 citations48