Inventor
UHLEMANN ANDRE
DE11 patents
⚠️ This page may combine multiple inventors who share the name “UHLEMANN ANDRE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
9 patentsUS8963321B2Feb 24, 2015
Semiconductor device including cladded base plate
INFINEON TECHNOLOGIES AG88 citations96
US9275926B2Mar 1, 2016
Power module with cooling structure on bonding substrate for cooling an attached semiconductor chip
INFINEON TECHNOLOGIES AG22 citations91
US11266012B2Mar 1, 2022
Circuit board, chip cooling housing, assembly and method for cooling a semiconductor chip
INFINEON TECHNOLOGIES AG7 citations83
US9578789B2Feb 21, 2017
Power semiconductor module with liquid cooling
INFINEON TECHNOLOGIES AG11 citations76
US9731370B2Aug 15, 2017
Directly cooled substrates for semiconductor modules and corresponding manufacturing methods
INFINEON TECHNOLOGIES AG4 citations71
US11778735B2Oct 3, 2023
Circuit board having a cooling area above and below a semiconductor chip
INFINEON TECHNOLOGIES AG0 citations60
US11631974B2Apr 18, 2023
Snubber circuit and power semiconductor module with snubber circuit
INFINEON TECHNOLOGIES AG1 citations60
US11810889B2Nov 7, 2023
External contact element for a power semiconductor module and power semiconductor module
INFINEON TECHNOLOGIES AG0 citations51
US11598904B2Mar 7, 2023
Power semiconductor module and method for producing a power semiconductor module
INFINEON TECHNOLOGIES AG0 citations51