Inventor
LEE CHAN-SUK
KR4 patents
Patents
4 patentsUS7199458B2Apr 3, 2007
Stacked offset semiconductor package and method for fabricating
SAMSUNG ELECTRONICS CO LTD25 citations87
US6984877B2Jan 10, 2006
Bumped chip carrier package using lead frame and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD14 citations79
US7485959B2Feb 3, 2009
Structure for joining a semiconductor package to a substrate using a solder column
SAMSUNG ELECTRONICS CO LTD2 citations61
US7414303B2Aug 19, 2008
Lead on chip semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50