Inventor · disambiguated record

Emil Lamco Jocson

Also filed as: JOCSON EMIL LAMCO

1 granted patent·1 pending application·0 citations·filing 2020–2024

7Inventor score

Technology areasH10W

Files withINFINEON TECHNOLOGIES AG2

Top patents by PatentIndex Score

2 records

0147US2025286012A1Semiconductor package having a ball-bond interconnect structure and related methods of manufacturingINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
0239US11705387B2Multi-layer interconnection ribbonINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jul 18, 2023·0 cites·17 claims

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