Inventor
LEE HYUNG-JU
KR22 patents
⚠️ This page may combine multiple inventors who share the name “LEE HYUNG-JU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HYUNDAI MOTOR CO LTD
12 patentsUS9920731B2Mar 20, 2018
Method and apparatus for restart when SSC is released
HYUNDAI MOTOR CO LTD6 citations69
US10363932B2Jul 30, 2019
SSC-SCC system for increasing SSC distance using SSC and method for controlling the same
HYUNDAI MOTOR CO LTD2 citations67
US10407064B2Sep 10, 2019
Method and apparatus for controlling driving of SSC-cruise system
HYUNDAI MOTOR CO LTD3 citations66
US11682506B2Jun 20, 2023
Rare-earth permanent magnet and method of manufacturing the same
HYUNDAI MOTOR CO LTD0 citations51
US10886062B2Jan 5, 2021
Method for preparing rare-earth permanent magnet
HYUNDAI MOTOR CO LTD0 citations51
US9805850B2Oct 31, 2017
NdFeB permanent magnet and method for producing the same
HYUNDAI MOTOR CO LTD0 citations50
US9739369B2Aug 22, 2017
Method and apparatus for selecting gear when SSC is released
HYUNDAI MOTOR CO LTD0 citations48
US9694820B2Jul 4, 2017
SSC control method and control apparatus thereof
HYUNDAI MOTOR CO LTD0 citations48
US9367377B2Jun 14, 2016
Apparatus and method for monitoring multiple micro-cores
HYUNDAI MOTOR CO LTD0 citations45
US10421223B2Sep 24, 2019
Apparatus and method for manufacturing permanent magnet
HYUNDAI MOTOR CO LTD0 citations39
US9458787B2Oct 4, 2016
Technique for correcting injector characteristics in engine of vehicle
HYUNDAI MOTOR CO LTD0 citations35
US10714246B2Jul 14, 2020
Rare earth permanent magnet and method for manufacturing thereof
HYUNDAI MOTOR CO LTD0 citations34
AMKOR TECHNOLOGY INC
8 patentsUS6713322B2Mar 30, 2004
Lead frame for semiconductor package
AMKOR TECHNOLOGY INC82 citations97
US6627976B1Sep 30, 2003
Leadframe for semiconductor package and mold for molding the same
AMKOR TECHNOLOGY INC64 citations96
US6525406B1Feb 25, 2003
Semiconductor device having increased moisture path and increased solder joint strength
AMKOR TECHNOLOGY INC69 citations95
US7521294B2Apr 21, 2009
Lead frame for semiconductor package
AMKOR TECHNOLOGY INC14 citations92
US6469369B1Oct 22, 2002
Leadframe having a mold inflow groove and method for making
AMKOR TECHNOLOGY INC26 citations92
US7928542B2Apr 19, 2011
Lead frame for semiconductor package
AMKOR TECHNOLOGY INC10 citations83
US7170150B2Jan 30, 2007
Lead frame for semiconductor package
AMKOR TECHNOLOGY INC10 citations83
US6616436B1Sep 9, 2003
Apparatus for manufacturing semiconductor packages
AMKOR TECHNOLOGY INC6 citations60