Inventor

WIMPLINGER MARKUS

AT70 patents

⚠️ This page may combine multiple inventors who share the name “WIMPLINGER MARKUS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WIMPLINGER MARKUS

EV GROUP E THALLNER GMBH

Device for bonding chips

Device and method for bonding substrates

Measuring device and method for measuring layer thicknesses and defects in a wafer stack

Device and method for bonding of two substrates

Accommodating device for retaining wafers

Apparatus and method for bonding substrates including changing a stoichiometry of oxide layers formed on the substrates

Method and device for bonding of chips

Device and method for bonding substrates

Method and device for surface treatment of substrates

Method and device for surface treatment of substrates

Method for applying a bonding layer

Method for applying a bonding layer

Device and method for bonding of two substrates

Accommodating device for retaining wafers

Method for permanent connection of two metal surfaces

Device and method for bonding of two substrates

Accomodating device for retaining wafers

Method for embossing of substrates

Device and method for permanent bonding

Method for bonding of chips

Device and method for bonding of two substrates

Method and device for surface treatment of substrates

Device and method for bonding substrates

Method and device for surface treatment of substrates

Device and method for bonding substrates

Device and method for bonding substrates

Device and method for bonding substrates

Device and method for bonding substrates

Method for permanent connection of two metal surfaces

Accommodating device for retaining wafers

Stamp and method for embossing

Apparatus and method for bonding substrates

Method and device for surface treatment of substrates

Method for applying a bonding layer

WIMPLINGER MARKUS

Apparatus, device and method for determining alignment errors

Accommodating device for retaining wafers

Device and method for separating a substrate from a carrier substrate

Measuring device and method for measuring layer thicknesses and defects in a wafer stack

Method for bonding of chips on wafers

Flexible substrate holder, device and method for detaching a first substrate

Method for bonding of chips on wafers

Method for bonding substrates

PLACH THOMAS

Method for permanently bonding wafers

Method for permanent bonding of wafers

Method for permanently bonding wafers

MARTINSCHITZ KLAUS

Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation

Method and device for permanent bonding of wafers, as well as cutting tool

LINDNER FRIEDRICH PAUL

Device for embossing of substrates

System for uniform structuring of substrates

DRAGOI VIOREL

Method for permanent connection of two metal surfaces